Pyrometer-Based Substrate Centering in Semiconductor Chambers
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Solution Overview
Problem
Current methods for centering substrates in semiconductor processing chambers are prone to human error and require manual recalibration, leading to inefficiencies and downtime, as they involve opening the chamber and relying on visual inspection.
Innovation Solution
A method using pyrometers to detect the substrate's edge and calculate offset values, allowing the robot arm to adjust the substrate's position without opening the chamber, by correlating delta time values with distance offsets through graphs or lookup tables, enabling precise centering in both X and Y directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual centering inspection is performed by opening the chamber, then centering accuracy can be visually verified, but chamber downtime increases and human error is introduced
Solution Approach 1:
The patent replaces manual visual inspection with an automated optical measurement system using pyrometers. The pyrometers detect substrate position through non-contact thermal radiation measurements, eliminating the need to open the chamber for centering verification while maintaining measurement precision.
Solution Approach 2:
The patent introduces pyrometers as intermediary measurement devices that can detect substrate position through the chamber wall without direct visual access. These pyrometers serve as mediators between the substrate and the control system, enabling automated centering measurements while the chamber remains closed.
2Ease of operation
If manual centering calibration is performed by a trained engineer, then centering can be adjusted, but human error is introduced and the process is time-intensive
Solution Approach 1:
The patent implements self-service automation where the system performs its own centering calibration without human intervention. The pyrometers automatically measure substrate position, the processor calculates offset values, and the robot arm autonomously adjusts the substrate centering, eliminating reliance on trained engineers and reducing human error.
Solution Approach 2:
The patent establishes a feedback loop where pyrometers continuously monitor substrate position, compare it against ideal centering parameters, and provide real-time correction signals to the robot arm. This automated feedback mechanism ensures consistent centering accuracy without human intervention.
3Difficulty of detecting and measuring
If the chamber is opened for centering inspection, then direct visual access to substrate position is obtained, but the chamber requires requalification and re-seasoning
Solution Approach 1:
The patent replaces direct visual measurement through chamber opening with remote optical measurement using pyrometers. These devices measure substrate position through thermal radiation detection without requiring physical access to the chamber interior, thereby avoiding the need for chamber requalification and re-seasoning.
Solution Approach 2:
The patent introduces pyrometers as intermediary measurement devices that can detect substrate position through the chamber wall. These pyrometers act as mediators that provide measurement capability without requiring chamber opening, thus avoiding the complex requalification process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces human error and downtime by automating the centering process, achieving precise alignment to within 0.25 mm without manual intervention, improving the efficiency and accuracy of semiconductor processing.
Implementation Method 1
obtaining a delta time value for a second pyrometer relative to a first pyrometer, where the delta time value is a duration of time between when the first pyrometer is covered by the substrate and when the second pyrometer is covered by the substrate
Data Source
AI summary
Embodiments disclosed herein include a method of centering a substrate in a chamber. In an embodiment, the method comprises inserting the substrate into the chamber with a robot arm, obtaining a delta time value for a second pyrometer relative to a first pyrometer, where the delta time value is a duration of time between when the first pyrometer is covered by the substrate and when the second pyrometer is covered by the substrate, calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the motion of the substrate, and comparing the time offset value to a graph or a lookup table that correlates the time offset value to a distance offset value.