Pyrotechnic Trigger Element Manufacturing via Photolithography and PVD
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing electrical triggering elements for pyrotechnic objects, such as detonators or igniters, face issues with unwanted material changes at the edges of the resistance layer due to high laser power during processing, affecting initiation characteristics and being time-consuming and costly.
Innovation Solution
A method involving photolithography to apply a lacquer on the substrate, followed by physical vapor deposition (PVD) to create a precisely defined electrically conductive layer, with subsequent metal plating and selective removal to define the resistor geometry, ensuring precise edges and homogeneous material distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser material processing is used to create the shape of the resistive surface, then the edges of the resistive layer can be defined, but unwanted material changes occur at the edges due to high laser power, negatively affecting initiation characteristics
Solution Approach 1:
The harmful laser processing step is extracted and replaced by a photolithographic approach where a resist mask is applied to define the resistive area geometry, and the PVD process is selectively applied only to the uncovered substrate areas, eliminating laser-induced material changes at edges
Solution Approach 2:
A photolithographic resist mask is introduced as an intermediary tool to define the geometry of the resistive area. The resist prevents PVD coating in specific areas, allowing precise edge definition without direct laser-material interaction that causes harmful material changes
2Manufacturing precision
If individual processing of each trigger element is performed, then precise control over each component is achieved, but the manufacturing process becomes very time-consuming
Solution Approach 1:
Multiple trigger elements are merged onto a single substrate and processed simultaneously using photolithography and PVD. The entire array of ignition elements can be manufactured in parallel on one substrate, then separated later, dramatically increasing productivity while maintaining precision through the photomask approach
Solution Approach 2:
The substrate is divided into multiple independent ignition element areas, each defined by the photomask pattern. This allows batch processing of multiple elements simultaneously while maintaining individual precision through the mask-defined geometry, resolving the contradiction between individual control and manufacturing speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise definition of resistor edges and geometry, reducing material changes and processing time, enabling mass production while maintaining high initiation characteristics and reducing costs.
Implementation Method 1
a resist is first applied to the substrate photolithographically
Implementation Method 2
The resistive layer, made of a metal with high resistivity, is applied to the substrate (e.g., ceramic or glass) using a physical vapor deposition (PVD) process
Implementation Method 3
a precisely defined area of the resistive strip is covered with resist. The entire substrate surface is then coated with a relatively thick layer of highly conductive metal (e.g., electroplated gold)
Data Source
AI summary
The invention relates to a method for manufacturing electrical triggering elements for pyrotechnic articles such as detonators or igniters, in which, in a first stage, a) a lacquer is photolithographically applied to a non-electrically conductive substrate, b) a conductive material is applied to the lacquer and substrate in a layer thickness of 0.02 µm to 8.0 µm and with a specific resistance of 0.1 Ω*mm to 5.0 Ω*mm by means of a PVD process, and c) the lacquer is removed from the substrate, and optionally, in a second stage, d) a photolithographic process is carried out again in which a precisely defined area of the resistive strip is covered with photoresist, e) the entire substrate surface is coated with a 0.1 µm to 20 µm thick layer of a metal with a specific resistance of 0.01 Ω*mm to 0.1 Ω*mm, wherein the application of the metal is designed such thatthat in areas where the substrate is bare from the first photolithography process, no metal adheres and f) the varnish is removed again by the second photolithography process.