Quantum Dot LED Substrate Bonding Layer for High-Resolution Printing

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Solution Overview

Problem

High-resolution active matrix organic light-emitting diode (AMOLED) products face challenges in alignment, low qualified product rates, and high production costs due to limitations in mask evaporation methods, which hinder their competitiveness with liquid crystal displays (LCDs).

Innovation Solution

A method for preparing a quantum dot light-emitting diode (QD-LED) substrate with a bonding layer, where quantum dots are bonded to the layer using organic functional groups capable of crosslinking, allowing for high-resolution production and improved product quality suitable for mass production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If mask evaporation method is used for preparing organic light-emitting layer, then alignment and evaporation area control can be achieved, but manufacturing complexity increases and qualified product rate decreases

Engineering Contradiction:
Improvealignment precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts and removes the mask evaporation step entirely, replacing it with a direct printing method that deposits quantum dot material without requiring alignment masks or vacuum evaporation equipment, thereby simplifying the manufacturing process while maintaining precision

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical mask alignment system with a printing-based direct deposition system, where patterned substrates or printing templates define the emission areas without requiring complex mask handling and alignment mechanisms

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If mask evaporation method is used for preparing organic light-emitting layer, then evaporation area control can be achieved, but productivity decreases and production cost increases

Engineering Contradiction:
Improveevaporation area controlVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent removes the time-consuming mask evaporation process and replaces it with a direct printing method that can deposit quantum dot material in the desired patterns more rapidly, improving production throughput

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs preliminary patterning of the substrate or printing template before material deposition, so that the emission areas are pre-defined and material can be deposited directly without requiring complex in-process alignment and control during evaporation

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If printing method is used for preparing organic light-emitting layer, then manufacturing simplicity improves, but resolution becomes extremely limited

Engineering Contradiction:
Improveprocess simplicityVSAvoiddisplay resolution
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the material parameters by using quantum dot materials with precisely controllable emission wavelengths based on particle size, allowing high-resolution color display while maintaining simple printing fabrication processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite quantum dot materials with specific size distributions and compositions that enable high-resolution emission patterns to be achieved through printing, combining the simplicity of printing with the precision of quantum dot optical properties

Inventive Principle:
Principle #40Composite materials

4Reliability

If quantum dot technology is adopted for high-resolution OLED, then quantum efficiency improves, but manufacturing difficulty increases due to reduced line width requirements

Engineering Contradiction:
Improvequantum efficiencyVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex vacuum evaporation and mask alignment systems with a printing-based direct deposition method that can achieve fine feature sizes without requiring reduced line widths in the mask or nozzle, maintaining quantum efficiency while simplifying manufacturing

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent achieves high-resolution local emission areas through printed quantum dot patterns with precise spatial control, where each pixel region receives quantum dot material in the exact desired location and configuration, maintaining high quantum efficiency without requiring overall process complexity

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables high-resolution QD-LED substrates with enhanced qualified product rates and cost-effectiveness, suitable for mass production, addressing the limitations of existing AMOLED technologies.

Implementation Method 1

wherein the light-emitting layer comprises a bonding layer and a quantum dot bonded to the bonding layer by bonding between organic functional groups of the quantum dot and organic functional groups of the bonding layer material

Methodology Applied
Scientific EffectCrosslinking reaction: Chemical Bonding

Data Source

PatentEP3401970B1Preparation method for a quantum dot light-emitting diode substrate
Publication Date: 2021.09.29 BOE TECHNOLOGY GROUP CO LTD
  • EP3401970B1 patent drawingFigure 1A~2-3
  • EP3401970B1 patent drawingFigure 2-4~2-8
  • EP3401970B1 patent drawingFigure 2-9~2-13

AI summary

A quantum dot light-emitting diode substrate having a bonding layer and a method of preparing the same are provided. The quantum dot light-emitting diode substrate comprising a plurality of sub-pixel light-emitting regions (115), wherein each of the sub-pixel light-emitting regions comprises a light-emitting layer (114) comprising a bonding layer (106) and a quantum dot (103) bonded to the bonding layer. The quantum dot light-emitting diode substrate can be prepared with high resolution by a convenient process, and is suitable for mass production.