QFN Package Structure With Grooved Posts for Heat Dissipation
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Solution Overview
Problem
The heat dissipation performance of quad flat no-lead (QFN) package devices is inadequate, leading to elevated temperatures that affect normal operational performance, and there is a need for improved connection methods to other circuit components.
Innovation Solution
A package structure with leads spaced apart from a base island, featuring connecting posts with lateral grooves and a plastic packaging layer that exposes end surfaces, allowing for multiple connection forms and enhanced heat dissipation through additional paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional QFN package structure is used, then the package dimension is reduced and signal transmission speed is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The package structure is segmented into multiple functional components: base island, leads, connecting posts, and plastic packaging layer. The connecting posts are further segmented with lateral grooves to increase surface area. This segmentation allows heat to be dissipated through multiple separate paths simultaneously, improving heat dissipation performance while maintaining the compact QFN form factor.
Solution Approach 2:
The invention transitions from traditional planar heat dissipation to three-dimensional heat dissipation by adding vertical connecting posts with lateral grooves. These posts extend in the vertical dimension and provide additional lateral heat dissipation surfaces, effectively utilizing multiple spatial dimensions to enhance heat dissipation capability without increasing the package footprint.
2Adaptability or versatility
If the package structure is simplified for manufacturing, then manufacturing cost is reduced, but connection versatility to other circuit components deteriorates
Solution Approach 1:
The connecting posts serve multiple functions: they provide electrical connection, mechanical support, and heat dissipation pathways. The lateral grooves on the connecting posts enable various connection methods (wire bonding, soldering, etc.), making the package structure universally adaptable to different circuit components and manufacturing processes, thereby enhancing connection versatility without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation by increasing the number of heat dissipation paths and allowing for various connection forms, ensuring the package structure operates within safe temperature limits and facilitates connections to other circuit components.
Implementation Method 1
a base island; leads spaced apart around the base island; a chip located on the base island and electrically connected to the leads; connecting posts located on the leads and connected to the leads... the plastic packaging layer is filled between the connecting posts and in the lateral grooves
Data Source
AI summary
Provided are a package structure, a stacked package structure, and a packaging method. leads in the package structure are spaced apart around a base island. Connecting posts are located on the leads and are connected to the leads, and end surfaces, which face away from a chip, of the connecting posts are provided with lateral grooves. A plastic packaging layer is filled between the connecting posts and in the lateral grooves, and the plastic packaging layer further exposes the end surfaces, which face away from the chip, of the connecting posts. Through the end surfaces, which are exposed from the plastic packaging layer, of the connecting posts, the package structure can be electrically connected to another circuit component from a side surface, thereby providing various connection forms.