Reflective Heat-Insulating QLED Package for Color Gamut
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Solution Overview
Problem
Existing LED packages used in liquid crystal display devices have poor color rendering capabilities and light output efficiency due to the use of yellow fluorescent powder, which results in limited color gamut coverage and reduced service life.
Innovation Solution
A reflective and heat-insulating QLED package device is developed, comprising a substrate with blue and green LED chips, a quantum dot adhesive layer, a reflecting layer, and a heat-insulating layer, where the LED chips are tiled and covered by the reflecting layer, and the quantum dots emit red light to produce white light, eliminating the need for a fluorescent powder layer and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If yellow fluorescent powder is used to generate white light, then the device structure is simple, but the color gamut coverage is limited and color rendering capability is poor
Solution Approach 1:
The patent segments the white light generation process by using separate blue and green LED chips instead of a single blue LED with yellow phosphor. This segmentation allows independent optimization of each LED chip's wavelength and intensity, enabling precise control over the spectral composition and significantly improving color gamut coverage while maintaining relatively simple device structure.
2Device complexity
If yellow fluorescent powder is used, then the device structure is simple, but the light output efficiency is reduced
Solution Approach 1:
The patent extracts and removes the yellow fluorescent powder from the system, replacing it with direct blue and green LED emission. This eliminates the energy conversion losses associated with phosphor down-conversion, as blue and green LEDs inherently emit at their peak wavelengths without requiring additional phosphor conversion steps, thereby improving light output efficiency while keeping the device structure relatively simple through direct emission.
3Ease of manufacture
If blue LED with yellow phosphor is used, then the manufacturing process is simple, but the service life is reduced
Solution Approach 1:
The patent employs a composite material approach by combining blue LED chip, green LED chip, and quantum dot adhesive layer in a integrated package structure. This composite design allows each component to be optimized for its specific function while working synergistically, improving overall device reliability and service life through distributed stress and failure modes compared to the single blue LED with phosphor approach.
4Device complexity
If quantum dots are exposed to moisture and oxygen, then the device structure is simple, but the quantum dots degrade and service life is reduced
Solution Approach 1:
The patent creates an inert environment by encapsulating quantum dots within a moisture and oxygen blocking adhesive layer. This protective barrier isolates the quantum dots from degrading environmental factors (moisture and oxygen), extending their operational lifetime and maintaining color stability without significantly increasing device complexity, as the blocking layer is integrated into the existing package structure.
5Area of stationary object
If LED chips are arranged in tiled manner with small distance, then the light output is compact, but heat dissipation becomes difficult
Solution Approach 1:
The patent introduces a heat-insulating layer as an intermediary between the LED chips and the underlying substrate. This heat-insulating layer acts as a thermal barrier that directs heat away from the compact tiled LED chip arrangement, preventing heat accumulation in the small package area while maintaining the compact layout, thereby solving the heat dissipation challenge through thermal management mediation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves color rendition and light output efficiency, extends the service life of the LED package by balancing light density and providing effective heat dissipation, while protecting quantum dots from moisture and oxygen.
Implementation Method 1
an adhesive layer for quantum dots, wherein the adhesive layer for quantum dots comprises a dense region of quantum dots and a sparse region of quantum dots... the quantum dots emit red light to produce white light
Implementation Method 2
a reflecting layer for changing the path of light rays... such that light rays can uniformly irradiate on the adhesive layer for quantum dots
Implementation Method 3
a heat-insulating layer... extending the service life of the LED package by balancing light density and providing effective heat dissipation
Data Source
AI summary
A reflective and heat-insulating QLED package device and a method for packaging the same as well as a luminaire are provided. The reflective and heat-insulating QLED package device includes a substrate, a first LED chip for emitting blue light, a second LED chip for emitting green light, an adhesive layer for quantum dots, a reflecting layer for changing the path of light rays, and a heat-insulating layer. The first LED chip and the second LED chip are arranged on the substrate in a tiled manner. The heat-insulating layer is arranged on the light output surface of the first LED chip and the second LED chip, a reflecting layer covers the heat-insulating layer, and a reflecting substance or a refractive substance is uniformly distributed in the reflecting layer. The adhesive layer for quantum dots covers the reflecting layer and is covered by a moisture and oxygen blocking adhesive layer.