QSFP-DD Backshell with Enlarged Inlet for 26 AWG Conductors

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Solution Overview

Problem

QSFP-DD copper cables face limitations in achieving full bandwidth over longer distances due to the compatibility issues with larger diameter conductors in the existing backshell design, which restricts data transfer speed to short distances.

Innovation Solution

A modified QSFP-DD connector backshell design that accommodates 26 AWG copper conductors and an over-mold strain relief, allowing for bundling of bulk cables to fit within the backshell, with a larger cable inlet and a bundling method that minimizes the overall diameter of the cable bundle to maintain compatibility with industry standards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the backshell dimensions are kept compliant with existing QSFP standards, then compatibility with legacy systems is maintained, but the cable diameter is restricted to maximum 27 AWG which limits data transfer distance

Engineering Contradiction:
Improvecompatibility with legacy systemsVSAvoiddata transfer distance
Core Design Contradiction:
Adaptability or versatilityVSLength of moving object

Solution Approach 1:

The backshell is divided into multiple components: a body portion with standard external dimensions for compatibility, and an internal cavity portion with enlarged dimensions to accommodate 26 AWG conductors. The locking latch is also segmented with its edge spaced away from the end wall to create additional internal space. This segmentation allows the backshell to maintain external compatibility while providing internal volume for larger conductors that enable longer data transfer distances.

Inventive Principle:
Principle #1Segmentation

2Reliability

If larger diameter conductors (26 AWG) are used to achieve full bandwidth over longer distances, then data transfer performance is improved, but the conductors no longer fit into the existing backshell design

Engineering Contradiction:
Improvedata transfer performanceVSAvoidfit into backshell
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The backshell exhibits different dimensional qualities in different regions: the external dimensions and shape maintain standard QSFP compliance for compatibility, while the internal cavity dimensions are locally enlarged to accommodate 26 AWG conductors. Specifically, the internal cavity has increased depth and width, and the locking latch edge is spaced away from the end wall, creating localized space expansion that allows larger conductors to be installed without affecting external compatibility.

Inventive Principle:
Principle #3Local quality

3Length of moving object

If the cable inlet diameter is enlarged to accommodate 26 AWG conductors and over-mold strain relief, then larger conductors can be installed, but the backshell internal volume is reduced

Engineering Contradiction:
Improvecable inlet diameterVSAvoidbackshell internal volume
Core Design Contradiction:
Length of moving objectVSVolume of stationary object

Solution Approach 1:

The locking latch is designed with its edge spaced away from the end wall, utilizing the depth dimension of the backshell to create additional internal volume. This dimensional arrangement allows the cable inlet to be enlarged in the radial direction while compensating for volume loss by extending the internal cavity depth, thereby maintaining sufficient internal volume to accommodate 26 AWG conductors with over-mold strain relief.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10983292B1QSFP-DD backshell
Publication Date: 2021.04.20 MELLANOX TECHNOLOGIES LTD(IL)
  • US10983292B1 patent drawing
  • US10983292B1 patent drawing
  • US10983292B1 patent drawing

AI summary

Presented herein is a backshell of a Quad Small Form-factor Pluggable Double Density (QSFP-DD) plug configured to be connected to the end of a QSFP-DD copper cable. The backshell includes an over-mold strain relief and 16 pairs of 26 AWG copper conductors. The backshell defines external dimensions and shape that are compliant with the industry standards for a QSFP backshell.