Quadrant Micro-Bolometer Infrared Sensor for Firearm Tracking
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Solution Overview
Problem
Current infrared detection systems for firearms lack precision in tracking targets emitting low levels of radiation, particularly in the 10-micron long-wavelength range, and require complex integration with dedicated read-out circuits and flip-chip packaging, which increases costs and reduces reliability.
Innovation Solution
A thermal position sensor utilizing a collection of micro-bolometers partitioned into quadrants, each with an absorptive element suspended above a substrate to absorb infrared radiation, causing resistance changes that indicate temperature, integrated with a thermoelectric cooler and an electronic unit to determine positional adjustments, simplifying packaging and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional infrared detection systems are used, then detection capability is provided, but measurement precision is insufficient for low-level radiation targets and device complexity increases due to dedicated read-out circuits and flip-chip packaging
Solution Approach 1:
The patent merges the infrared detection function with the position sensor function into a single integrated detector. The detector comprises a substrate with an absorptive element that directly generates position-dependent electrical signals in response to incident infrared radiation, eliminating the need for separate read-out circuits and complex packaging. This integration resolves the contradiction by simplifying the system while maintaining detection capability.
2Reliability
If traditional infrared detection systems with dedicated read-out circuits are used, then detection function is provided, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions into a single detector structure that can be manufactured as one integrated component. The detector includes a substrate with an absorptive element that directly converts infrared radiation into position-dependent electrical signals, eliminating the need for separate read-out circuits and complex flip-chip packaging. This integration reduces manufacturing steps, materials, and assembly complexity, thereby lowering costs while maintaining reliability.
3Measurement precision
If complex integration with dedicated read-out circuits is used, then detection capability is provided, but manufacturing complexity increases
Solution Approach 1:
The patent integrates the infrared absorption and position sensing functions into a single detector structure where the absorptive element on the substrate directly generates position-dependent electrical signals. This eliminates the need for complex flip-chip packaging and dedicated read-out circuits, reducing manufacturing precision requirements while maintaining tracking precision through the inherent position sensitivity of the integrated detector.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances aiming accuracy and efficiency by accurately tracking targets emitting low levels of radiation, improving aiming selectivity and reducing aiming time, while being more cost-effective and reliable than traditional systems.
Implementation Method 1
an absorptive element suspended above a substrate and configured to absorb infrared radiation
Implementation Method 2
A bolometer is a device that can be used to measure the power of radiation that is incident on the bolometer. In general, a bolometer can be used as a resistive device whose resistance varies with a temperature of the bolometer
Implementation Method 3
The thermal position sensor may also include a thermoelectric cooler disposed underneath the collection of micro-bolometers and configured to cool the collection of micro-bolometers
Data Source
AI summary
A thermal position sensor includes a collection of micro-bolometers, each having an electrical resistance and each including a substrate and an absorptive element. The absorptive element is suspended above the substrate and configured to absorb infrared radiation, including 10-micron long-wavelength infrared radiation. A change in a temperature of the micro-bolometer causes a change in the resistance of the micro-bolometer. The collection of micro-bolometers is partitioned into a first quadrant, a second quadrant, a third quadrant, and a fourth quadrant, where each of the quadrants represents a 90-degree segment of the sensor and includes at least one micro-bolometer of the collection of micro-bolometers. Each of the quadrants includes at least one output signal that provides information indicative of a temperature of the quadrant based on a resistance associated with the at least one micro-bolometer of the quadrant.