Quantum Device Assembly With Local Bump Heating for Qubit Protection
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Solution Overview
Problem
The challenge in manufacturing quantum devices is that heating the second bump to mount the first substrate over the second substrate can cause a change in the characteristics of the qubit chip due to temperature increase, which affects the qubit device's performance.
Innovation Solution
The method involves mounting the qubit chip over a first substrate using a first bump and then locally heating the second bump at a position not overlapping the qubit chip, without any joining member at that overlap, to minimize temperature increase and maintain the qubit chip's characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the second bump is heated to mount the first substrate over the second substrate, then the mounting process can be completed, but the temperature increase causes a change in the characteristics of the qubit chip
Solution Approach 1:
The heating process is segmented into localized regions. The heating apparatus applies heat only to the second bump region, separating the heating zone from the qubit chip region. This allows the mounting process to proceed while the qubit chip remains at a lower temperature, preventing characteristic changes.
Solution Approach 2:
The patent implements local heating where only the second bump area is heated to the required temperature for mounting. The qubit chip area maintains a different (lower) temperature. This local quality approach allows the mounting process to complete while preserving the temperature-sensitive characteristics of the qubit chip.
2Device complexity
If the second bump is heated uniformly across the first substrate, then the mounting process is simplified, but the qubit chip temperature increases causing characteristic changes
Solution Approach 1:
The heating process is divided into separate controlled zones. The heating apparatus is configured to heat only the second bump region, creating a segmented thermal profile across the first substrate. This segmentation enables simplified mounting at the bump location while maintaining lower temperatures at the qubit chip location.
Solution Approach 2:
The patent applies local quality by creating different thermal conditions in different regions of the first substrate. The second bump region experiences high temperature for mounting, while the qubit chip region experiences lower temperature to preserve characteristics. This spatial variation in thermal quality resolves the contradiction between mounting simplicity and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the temperature rise of the qubit chip, thereby preserving its characteristics and ensuring accurate positioning during the mounting process.
Implementation Method 1
locally heating a second bump provided at a position that does not overlap the qubit chip in plan view
Data Source
AI summary
A method for manufacturing a quantum device, the method includes: mounting a qubit chip over a first substrate by using a first bump; and mounting the first substrate over a second substrate by, after mounting the qubit chip, locally heating a second bump provided at a position that does not overlap the qubit chip in plan view, wherein no joining member that joins the first substrate and the second substrate is provided between the first substrate and the second substrate at a position that overlaps the qubit chip in plan view.