Quantum Computing Assembly Package Substrate Interconnects
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Solution Overview
Problem
Conventional package technologies are inadequate for quantum computing applications due to challenges in communicating large numbers of signals between dies, thermal constraints, and power delivery, especially in extreme operational environments, leading to mechanical and electrical reliability issues.
Innovation Solution
The development of quantum computing assemblies that utilize a package substrate with conductive pathways and dies with insulating materials, along with advanced interconnects such as DTPS and DTD interconnects, to achieve reliable attachment and power delivery while reducing package size and mechanical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package technologies are used for quantum computing assemblies, then manufacturing and assembly are simpler, but signal losses increase and reliability deteriorates in extreme operational environments
Solution Approach 1:
The quantum computing assembly is divided into multiple dies (first die, second die) coupled to opposite surfaces of a package substrate. This segmentation allows independent optimization of each die for quantum processing while the package substrate provides dedicated conductive pathways for signal communication, reducing signal losses and improving electrical reliability without requiring a monolithic complex structure.
Solution Approach 2:
The package substrate acts as an intermediary component between the first die and second die, providing controlled conductive pathways that mediate signal transmission. This intermediary structure enables reliable signal communication through the package while isolating the quantum dies from direct mechanical and electrical stresses, thereby improving electrical reliability without excessive complexity.
2Reliability
If conventional package technologies are used, then device fabrication is less complex, but mechanical stresses increase leading to reliability issues
Solution Approach 1:
The assembly separates mechanical support functions (package substrate) from quantum processing functions (dies). The package substrate provides mechanical support and stress distribution across its structure, while the dies are coupled to opposite surfaces, reducing mechanical stresses on interconnects and improving mechanical reliability without requiring overly complex packaging.
Solution Approach 2:
The package substrate provides localized conductive pathways at specific locations to connect the first die and second die. This localized interconnection approach reduces the overall complexity of the interconnect structure while providing sufficient mechanical support and electrical connection where needed, improving mechanical reliability without excessive complexity.
3Volume of stationary object
If package size is reduced to improve integration, then integration density increases, but signal losses increase and reliability decreases
Solution Approach 1:
The package substrate provides localized conductive pathways with optimized geometry and material properties specifically at the regions where signal transmission occurs between dies. This localized optimization of conductive path quality reduces signal losses even as the overall package size is reduced, maintaining signal transmission reliability while improving integration density.
4Reliability
If advanced interconnects are implemented to reduce signal losses, then signal transmission quality improves, but manufacturing complexity increases
Solution Approach 1:
The package substrate serves as an intermediary that incorporates the advanced conductive pathways within its structure, separating the complexity of signal transmission optimization from the die assembly process. This allows advanced interconnect features to be implemented in the substrate using standard PCB or semiconductor packaging techniques, improving signal transmission reliability while maintaining reasonable manufacturing ease through established fabrication processes.
Data Source
AI summary
Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.