Ceramic Package for Quantum Computing
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Solution Overview
Problem
Current quantum computing systems face challenges with large space occupation, long signal transmission paths, low assembly density, and poor heat dissipation due to the use of multiple single-function modules and inadequate packaging materials.
Innovation Solution
A ceramic package for quantum computing is developed, comprising aluminum nitride ceramic plates and a copper-based vacuum tube, with silver-copper and gold-tin soldering, optimized for lightweight, high thermal conductivity, and efficient heat dissipation, featuring a dual-layer structure with coaxially arranged through holes and light windows for improved signal transmission and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple single-function modules are arranged in a flat layout on a system board, then the system can process quantum signals of light, but the space occupation increases and assembly density decreases
Solution Approach 1:
The patent integrates multiple single-function modules into a unified ceramic package structure where multiple functional components (light source, vacuum tube, light windows, lead wires) are combined within a single compact package, eliminating the need for separate modules arranged on a system board and thereby reducing space occupation while maintaining signal processing capability
Solution Approach 2:
The ceramic package serves multiple functions simultaneously: it provides structural support, enables light transmission through light windows, maintains vacuum environment, conducts heat dissipation, and facilitates signal transmission through lead wires, thereby replacing multiple single-function modules with one multi-functional package
2Ease of manufacture
If modules use alumina ceramic package or plastic package, then the package structure is simple, but the heat dissipation performance is poor
Solution Approach 1:
The patent employs a composite package structure combining aluminum nitride ceramic material with high thermal conductivity, silver-copper solder sheets for thermal and electrical connection, and gold-tin solder for vacuum sealing, creating a multi-material system that achieves both structural simplicity and superior heat dissipation performance
3Productivity
If light windows are installed on ceramic plates with coaxially arranged through holes, then the signal transmission path is shortened, but the manufacturing complexity increases
Solution Approach 1:
The patent transitions from a planar flat layout to a three-dimensional stacked structure with ceramic plates arranged vertically, light windows installed on opposing surfaces, and coaxially aligned through holes, utilizing the vertical dimension to shorten signal transmission paths while organizing components in a compact layered configuration
4Productivity
If vacuum tube is connected with ceramic plates using solder sheets, then the assembly density increases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies precise material composition parameters for the solder sheets (silver-copper alloy for thermal/electrical connection, gold-tin alloy for vacuum sealing) and controls soldering process parameters to achieve reliable connections between the vacuum tube and ceramic plates, enabling high assembly density while meeting stringent manufacturing precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic package enhances operational efficiency by shortening signal transmission paths, improving heat dissipation, and increasing assembly density, while maintaining high-quality light source signal transmission in a low-vacuum environment, thus addressing the limitations of existing systems.
Implementation Method 1
the vacuum tube and the first ceramic plate may be connected by a first solder sheet, and the vacuum tube and the second ceramic plate may be connected by the first solder sheet
Implementation Method 2
the first ceramic plate and the second ceramic plate may be both aluminum nitride ceramic plates
Data Source
AI summary
The present disclosure provides a ceramic package for quantum computing and a method for preparation. The ceramic package for quantum computing may include a first ceramic plate, a vacuum tube, and a second ceramic plate connected sequentially from bottom to top, wherein the first ceramic plate is installed with a first light window, the second ceramic plate is installed with a second light window, the first light window and the second light window cover a signal inlet and a signal outlet of the vacuum tube, respectively; the first ceramic plate is provided with a lead wire on a side depart from the vacuum tube and configured to lead a signal into a system. The method for preparation may include placing the first ceramic plate, the vacuum tube, the second ceramic plate, the lead wire, and the first solder sheet in a mold for positioning, and soldering the solder sheet into a sintered member by heating and melting the solder sheet; plating nickel and gold on an outer surface of the sintered member, respectively; providing a gold layer on a welding surface of the light window and a plating layer on a photon signal passage; and soldering a gold-plated sintered member to the first light window and the second light window with gold and tin through the second solder sheet, respectively, to form a ceramic package with a vacuum channel.