Quantum Chip Holder With Vacuum Suction to Suppress Box Resonance
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Solution Overview
Problem
In superconducting quantum circuits, the contact between metal surfaces of a holder and a quantum chip leads to dielectric loss and box resonance, reducing the internal Q factor and overall quality of the quantum chip.
Innovation Solution
A holder design with a pedestal and a suction tube is used, where the suction tube is positioned to adhere the quantum chip, preventing direct contact between metal surfaces and thus minimizing dielectric loss and box resonance, while ensuring the chip's stability through vacuum adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal surfaces of a holder contact with a quantum chip, then the quantum chip is fixed and supported, but dielectric loss and box resonance occur reducing internal Q factor
Solution Approach 1:
The patent extracts the harmful metal surfaces from the holder by creating a recess portion that removes metal surfaces opposing the quantum chip. This extraction eliminates the source of dielectric loss and box resonance while maintaining the holder's structural integrity and quantum chip support functionality through non-metallic materials or spaced configurations in the recessed area.
Solution Approach 2:
The patent introduces an intermediary approach by using a recess portion as a spatial mediator between the holder and quantum chip. This recess creates a non-contact zone that prevents direct metal-superconductor contact, thereby eliminating harmful electromagnetic interactions while still allowing mechanical support and positioning functions to be performed.
2Reliability
If a counterbore treatment is applied to reduce metal surfaces, then dielectric loss and box resonance are prevented, but the quantum chip may fall into the space region or slantingly arrange reducing stability
Solution Approach 1:
The patent applies local quality by creating a recess portion with specific geometric characteristics that provide both quantum chip support and prevent harmful metal contact. The recess is designed with appropriate depth, width, and positioning to maintain chip stability through controlled support zones while eliminating metal surfaces in critical opposing areas, thus simultaneously achieving both stability and high Q factor.
3Stability of the object's composition
If vacuum adhesion is used to fix the quantum chip, then chip stability is improved, but metal surfaces surrounding the adhesion hole still form capacitors causing dielectric loss
Solution Approach 1:
The patent segments the holder structure by creating a recess portion that isolates and removes metal surfaces in the area opposing the quantum chip. This segmentation separates the vacuum adhesion zone from harmful metal contact zones, allowing vacuum fixation to be performed through non-metallic or recessed areas while eliminating capacitor formation at metal-superconductor interfaces, thus resolving both stability and Q factor requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the stability and quality of the quantum chip by inhibiting dielectric loss and box resonance, improving circuit characteristics during measurement.
Implementation Method 1
a suction tube (13) configured to be attachable to and detachable from the pedestal (11)... performing suction of the quantum chip (51) via the suction tube (13), and the quantum chip (51) is thereby adhered to the suction opening (13a) of the suction tube (13)
Data Source
AI summary
A quantum device includes a quantum chip and a holder. The holder includes a pedestal, a recess portion formed in a main surface of the pedestal so as to be opposed to the quantum chip, and a suction tube provided such that in the recess portion, a suction opening is positioned in a bottom surface of the quantum chip.