Quantum Chip Recess Mounting for Cryogenic Cooling and Terminal Density
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Solution Overview
Problem
The existing quantum device has limited terminal output due to using one surface of the interposer for cooling, which restricts the number of terminals that can be extracted while requiring the quantum chip to be cooled to a specific temperature for performance.
Innovation Solution
A quantum device design where the quantum chip is mounted inside a recessed sample stage with a cooling function, allowing the interposer to be in contact with the sample stage for enhanced cooling and maximizing terminal output by utilizing the opposite surface for terminal extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If one surface of the interposer is used for cooling by the sample stage, then the quantum chip can be cooled to a predetermined temperature, but the number of terminals that can be drawn out is limited
Solution Approach 1:
The invention transitions from a two-dimensional cooling approach (cooling from one surface only) to a three-dimensional approach by forming a recess in the sample stage that allows cooling from multiple surfaces simultaneously. The quantum chip is positioned within the recess such that its bottom surface contacts the recessed portion for cooling, while its side surfaces can also be cooled through the recess walls, thereby improving cooling efficiency without occupying additional interposer surface area for terminals.
2Temperature
If the quantum chip is cooled from the sample stage through the interposer, then the quantum chip is kept at a predetermined temperature, but the cooling effect is insufficient when the quantum chip has a large area
Solution Approach 1:
The invention segments the cooling interface by creating a recess in the sample stage that directly exposes the bottom surface of the quantum chip to the cooling stage. This segmentation allows different regions of the quantum chip (bottom surface and side surfaces) to be cooled through separate thermal pathways, improving overall cooling efficiency and reducing thermal resistance compared to cooling through the entire interposer thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency while allowing for a higher number of terminal outputs, enabling stable operation of the quantum chip and reducing stress and strain from temperature changes.
Implementation Method 1
the quantum chip is cooled from the sample stage through the interposer and kept at a predetermined temperature
Data Source
AI summary
Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.