3D Quantum Circuit Routing via Vertical Through-Holes
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Solution Overview
Problem
Conventional methods for connecting interior quantum circuits in quantum computing systems face challenges due to decoherence issues caused by microwave-quality dielectrics, which disrupt the coherence necessary for quantum computing.
Innovation Solution
A two-dimensional quantum circuit structure with a bottom chip, a device layer, and a top chip, where through holes are fabricated to route signals from the routing layer to the device layer using wirebonds, minimizing decoherence and allowing for compact and efficient communication within the quantum lattice.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring methods are used to connect interior quantum circuits, then signal routing is achieved, but decoherence issues occur due to microwave-quality dielectrics disrupting quantum coherence
Solution Approach 1:
The patent transitions from planar 2D wiring to 3D vertical routing by stacking quantum circuit layers. Through-holes penetrate the substrate vertically, allowing signal wires to connect interior qubits to external structures without using harmful microwave-quality dielectric materials in the signal path, thus resolving the decoherence issue while maintaining reliable signal routing.
2Ease of manufacture
If a two-dimensional plane structure is used for quantum circuits, then manufacturing is simplified, but interior quantum circuits cannot efficiently communicate with external structures
Solution Approach 1:
The patent adds a vertical dimension to the traditionally planar quantum circuit architecture by implementing through-holes that penetrate the substrate. This allows interior quantum circuits to communicate with external structures efficiently without complicating the manufacturing process, as the through-holes can be integrated into existing fabrication workflows.
3Ease of manufacture
If signal wires remain in the same plane as quantum circuits, then manufacturing is easier, but decoherence is increased due to proximity to qubits
Solution Approach 1:
The patent moves signal wires from the horizontal plane to the vertical dimension by routing them through holes perpendicular to the quantum circuit plane. This spatial separation reduces electromagnetic interference and decoherence between signal wires and qubits while maintaining ease of manufacture through standard wire bonding techniques adapted for vertical routing.
Data Source
AI summary
Embodiments of the present invention disclose a computer system having a plurality of quantum circuits arranged in a two-dimensional plane-like structure, the quantum circuits comprising qubits and busses (i.e., qubit-qubit interconnects), and a method of formation therefor. A quantum computer system comprises a plurality of quantum circuits arranged in a two-dimensional pattern. At least one interior quantum circuit, not along the perimeter of the two-dimensional plane of the plurality of quantum circuits, contains a bottom chip, a device layer, a top chip, and a routing layer. A signal wire connects the device layer to the routing layer, wherein the signal wire breaks the two dimensional plane, for example, the signal wire extends into a different plane.