Quantum Object Confinement Chip Arrangement
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Solution Overview
Problem
Existing methods of tiling quantum object traps result in a high fill factor with minimal edge space, leading to long and lossy routing traces for signals, increased power consumption, and a limited footprint that does not accommodate larger components like ASICs.
Innovation Solution
A quantum object confinement apparatus comprising a plurality of chips arranged such that an open area is formed between at least two chips, allowing for improved spacing and accommodation of additional components like photonic components and input/output devices, while maintaining efficient quantum operation and storage functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If quantum object traps are placed side-by-side in an arrayed manner with high fill factor, then the area utilization is maximized, but the edge space for additional components is minimized and signal routing traces become long and lossy
Solution Approach 1:
The quantum computing system is divided into multiple separate chips, each containing one or more quantum object traps. This segmentation allows for optimized routing within each chip while maintaining high area utilization through the modular chip architecture.
Solution Approach 2:
The patent transitions from a two-dimensional planar array to a three-dimensional stacked configuration with multiple chips positioned at different heights (z-axis). This vertical arrangement provides edge space for components while maintaining compact footprint and enabling shorter routing traces through localized connections.
2Area of stationary object
If quantum object traps are placed side-by-side in an arrayed manner, then the footprint is minimized, but sufficient space for mounting ASICs and other components is not provided
Solution Approach 1:
The system utilizes the third dimension (vertical stacking) to accommodate additional components such as ASICs, photonic components, and I/O devices on separate chips. This enables component accommodation without increasing the horizontal footprint, as each chip layer provides mounting surfaces for its associated components.
Solution Approach 2:
Multiple functional components are nested across different chip layers, with each chip containing quantum traps and associated components. The stacked configuration allows smaller functional units to be nested within the overall system structure, maximizing component density while maintaining accessibility.
3Area of stationary object
If quantum object traps are placed side-by-side in an arrayed manner, then area utilization is maximized, but power consumption increases due to long routing traces
Solution Approach 1:
By segmenting the system into multiple chips, each chip handles localized quantum operations and signal routing. This reduces the overall routing trace length within each chip compared to a single large array, thereby reducing power consumption while maintaining high area utilization through the modular configuration.
Data Source
AI summary
A confinement apparatus includes a plurality of chips. Each chip of the plurality of chips are positioned at least partially on a first plane and adjacent to at least another one of the plurality of chips such that a distance between them is within 20 micrometer (μm) of each other. The plurality of chips are arranged such that at least one open area is formed on the plane and between at least two of the plurality of chips. The at least one open area extends a distance of at least 100 μm between a smallest distance between the at least two of the plurality of chips.