Quantum Computer DC Line Twisting for Low Thermal Conductivity
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Solution Overview
Problem
Existing direct current lines for quantum computers face challenges in achieving extremely low thermal conductivity, compact size, and flexibility, making them unsuitable for low-temperature and compact environment applications.
Innovation Solution
A novel direct current line forming method involving a low thermal conductivity wire without a central reinforcement member, twisted multiple times in a specific arrangement (2*2*2*3) to form a wire core, and then wrapped with a non-metallic outer sheath to reduce thermal conductivity and enhance flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal center reinforcement and shielding layer are used in the direct current line, then the strength and anti-interference capability are improved, but the thermal conductivity increases and the volume increases
Solution Approach 1:
The patent removes the metal center reinforcement and metal shielding layer from the cable structure, extracting the harmful thermal conductivity while retaining cable functionality through alternative materials and designs
Solution Approach 2:
The patent uses composite material structures including non-metallic shielding layers and specific wire combinations (such as tungsten and molybdenum wires) to achieve both mechanical strength and low thermal conductivity simultaneously
2Reliability
If a metal center reinforcement and shielding layer are used in the direct current line, then the strength and anti-interference capability are improved, but the volume increases
Solution Approach 1:
The patent removes the metal center reinforcement and metal shielding layer from the cable structure, extracting the harmful thermal conductivity while retaining cable functionality through alternative materials and designs
Solution Approach 2:
The patent employs thin non-metallic shielding layers and flexible wire arrangements that provide necessary protection and functionality while minimizing cable volume
3Reliability
If the existing direct current line structure is used, then the signal transmission is ensured, but the bending property is reduced
Solution Approach 1:
The patent employs thin non-metallic shielding layers and flexible wire arrangements that provide necessary protection and functionality while minimizing cable volume
Solution Approach 2:
The patent uses flexible wire arrangements and non-rigid structures that allow the cable to adapt its shape and bend easily while maintaining signal transmission capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the thermal conductivity and bending radius of the direct current line, allowing it to be used in tight spaces and low-temperature environments while minimizing signal interference.
Implementation Method 1
wrapping the outside of the guide wire with an insulating paint layer to form a wire
Implementation Method 2
twisted multiple times to form a wire core in an arrangement of 2*2*2*3, reducing the thermal conductivity of the direct current line
Data Source
AI summary
The application discloses an extremely low thermal conductivity direct current line forming method, including: adopting a guide wire made of a titanium alloy material, wrapping the guide wire with an insulating paint layer to form a wire, twisting the wire for multiple times to sequentially form a small wire pair, a large wire pair, a wire set and a wire core, and wrapping the wire core with an outer sheath made of a non-metallic material to form a direct current line. The application further discloses a direct current line used for a quantum computer and manufactured through the extremely low heat conductivity direct current line forming method.