Quantum Dot Conversion Element Production via Intermediary Carrier
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Solution Overview
Problem
Current methods for producing quantum-dot-based conversion elements, such as spray coating and screen printing, are problematic due to the toxicity of cadmium selenide, leading to contamination and complex cleaning processes, and there is a lack of harmless alternatives for layer attachment on semiconductor chips.
Innovation Solution
A method involving a first application technique for a conversion material followed by compression molding of quantum dots within a matrix material, allowing for the production of conversion elements that are safer from an EHS perspective, using techniques like spray coating and compression molding to apply these elements on carriers, which can then be separated into individual conversion elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spray coating or screen printing is used to apply quantum dots, then the conversion elements can be produced, but the process chamber becomes contaminated with toxic cadmium selenide material requiring complex cleaning
Solution Approach 1:
A temporary carrier serves as an intermediary between the quantum dot application process and the final semiconductor chip. The quantum dots are applied to the temporary carrier using compression molding, which prevents direct contamination of the process chamber. The carrier then transports the quantum dots to the chip without requiring cleaning of the application system.
Solution Approach 2:
The production process is segmented into distinct stages: quantum dot application on a temporary carrier, hardening of the matrix material, and subsequent transfer to the semiconductor chip. This segmentation allows the toxic quantum dot handling to be isolated to a controlled environment on the carrier, separating it from the chip processing environment.
2Productivity
If conventional application techniques are used for quantum dots, then conversion elements can be produced, but relatively large quantities of toxic waste material are generated
Solution Approach 1:
The temporary carrier acts as a mediator that enables precise placement of quantum dots onto the semiconductor chip. This intermediary approach allows for controlled material usage and minimizes waste generation by ensuring quantum dots are applied only where needed, rather than through spray or screen methods that generate excess material waste.
3Ease of manufacture
If quantum dots are applied directly to semiconductor chips using conventional methods, then conversion elements can be produced, but complex cleaning of the system is required
Solution Approach 1:
The temporary carrier serves as a mediator that eliminates the need for complex cleaning systems. By applying quantum dots to the carrier rather than directly to the chip or in an open chamber, the system avoids contamination of expensive equipment. The carrier can be easily removed and disposed of or reused without requiring cleaning of the application system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of conversion elements with reduced environmental and health hazards, avoiding contamination and complex cleaning, while allowing for efficient application of quantum dots on semiconductor chips, facilitating safer and more cost-effective production of optoelectronic components.
Implementation Method 1
D) hardening of the matrix material
Data Source
AI summary
A method produces a plurality of conversion elements including: A) providing a first carrier; B) applying a first element to the first carrier using a first application technique, the first element including a conversion material, the first application technique being different from compression molding; C) applying a second element to the first carrier by a second application technique, the second element including quantum dots, the quantum dots being introduced into a matrix material and being different from the conversion material, the second application technique being molding or compression molding; D) hardening of the matrix material; E) optionally, rearranging the arrangement produced according to step D) to a second carrier; and F) separating so that a plurality of conversion elements are generated.