Optoelectronic Semiconductor Device with Quantum Dot Encapsulation

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Solution Overview

Problem

Existing semiconductor devices with wavelength-converting conversion materials face challenges in miniaturization and durability due to sensitivity to oxidation, water, and temperature fluctuations, making it difficult to produce compact and long-lasting optoelectronic semiconductor devices.

Innovation Solution

A method involving semiconductor chips with a III-V compound semiconductor material, where conversion elements with wavelength-converting quantum dots are encapsulated using a protective material to prevent moisture and oxygen exposure, and the package body assembly is formed using a casting method to create a compact and efficient optoelectronic semiconductor device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conversion elements with sensitive conversion material are used for wavelength conversion, then color rendering precision is improved, but reliability deteriorates due to sensitivity to oxidation, water, and temperature fluctuations

Engineering Contradiction:

Improvecolor rendering precisionVSAvoidservice life

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent applies preliminary anti-action by pre-encapsulating the sensitive conversion elements in a protective package body assembly before mounting them on the semiconductor chip. This protective encapsulation is established in advance to prevent oxidation, water ingress, and temperature fluctuations that would otherwise damage the conversion material and reduce reliability.

Inventive Principle:

Principle #9Preliminary anti-action

Solution Approach 2:

The patent uses an intermediary approach by introducing a protective package body assembly as a mediator between the sensitive conversion elements and the harsh environment. This intermediate protective structure shields the conversion material from direct exposure to oxidizing atmospheres, moisture, and thermal stress while allowing the device to function.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If package body assembly is formed using casting method to protect conversion elements, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveprotection of conversion elementsVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the package body assembly by combining protective encapsulation, mechanical support, and thermal management functions into a single integrated component. The casting method simultaneously achieves protection of conversion elements and structural support, reducing the need for additional separate protective components and simplifying the overall device architecture.

Inventive Principle:

Principle #5Merging (Combining)

3Duration of action of stationary object

If conversion elements are encapsulated to prevent moisture and oxygen exposure, then service life is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveservice lifeVSAvoidmanufacturing ease

Core Design Contradiction:

Duration of action of stationary objectVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming the protective package body assembly around the conversion elements before the final device assembly is completed. This preliminary encapsulation ensures that the sensitive conversion material is protected from moisture and oxygen exposure throughout the manufacturing process and device operation, extending service life while allowing subsequent manufacturing steps to proceed without additional protective measures.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method results in optoelectronic semiconductor devices with enhanced service life and compact design, suitable for backlighting applications, achieving precise color rendering and efficient manufacturing through complete encapsulation and protection of sensitive conversion materials.

Implementation Method 1

a semiconductor body with an active region provided for generating electromagnetic radiation

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

conversion elements consisting of a wavelength-converting conversion material

Methodology Applied

Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS10103296B2Method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device

Publication Date: 2018.10.16 OSRAM OLED

AI summary

A method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device are disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips for producing electromagnetic radiation, arranging the plurality of semiconductor chips in a plane, forming a housing body composite, at least some regions of which are arranged between the semiconductor chips, forming a plurality of conversion elements, wherein each conversion element comprises a wavelength-converting conversion material and is arranged on one of the semiconductor chips, encapsulating the plurality of conversion elements at least on their lateral edges by an encapsulation material, and separating the housing body composite into a plurality of optoelectronic semiconductor components.