Quantum Dot Film Transfer for Uniform LED Color Packaging
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Solution Overview
Problem
The existing manufacturing processes for quantum dot LED packaging face challenges with humidity stability and uneven distribution of quantum dots, leading to inconsistent color coordinates and reduced efficacy due to multi-layer stacking and repeated injection of quantum dot adhesive.
Innovation Solution
A manufacturing process involving the creation of a quantum dot film with a light conversion layer, thermally conductive layer, and water-oxygen barrier layers, which is then applied to a transparent adhesive layer on the LED chip, ensuring uniform distribution and stability through a peelable substrate and subsequent curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If quantum dot adhesive is injected multiple times on LED chips, then all chips can be packaged, but quantum dots lose efficacy and color coordinates become uneven
Solution Approach 1:
The patent segments the quantum dot adhesive application process by creating a separate quantum dot film that is then transferred to the LED chip in a single step. This is achieved by: (1) preparing a quantum dot film on a carrier substrate, (2) transferring the entire film to the LED chip using a transfer substrate, and (3) curing in one operation. This segmentation resolves the contradiction by eliminating repeated injections while maintaining uniform quantum dot distribution across all chips.
Solution Approach 2:
The patent applies preliminary action by pre-preparing the quantum dot film on a carrier substrate before transfer to the LED chip. The quantum dots are dispersed in adhesive and cured on the carrier substrate in advance, creating a ready-to-transfer film. This preliminary preparation allows single-step transfer to multiple LED chips, avoiding repeated injection operations and ensuring consistent quantum dot distribution.
2Productivity
If quantum dot adhesive is injected multiple times, then packaging is completed, but thickness becomes uneven after curing
Solution Approach 1:
The patent segments the packaging process into film preparation and film transfer stages. The quantum dot film is formed with uniform thickness on the carrier substrate first, then transferred as a complete unit to the LED chip. This segmentation ensures that thickness uniformity is established during film formation and maintained during transfer, eliminating the thickness variation caused by repeated injections.
Solution Approach 2:
The patent uses a flexible quantum dot film that can be easily transferred from the carrier substrate to the LED chip. The film's flexibility allows it to conform to the chip surface while maintaining uniform thickness. The thin film structure enables complete transfer in one operation, avoiding the layer-by-layer stacking that causes thickness non-uniformity.
3Ease of manufacture
If quantum dots are dispersed in adhesive for in-situ packaging, then packaging is achieved, but humidity stability is poor
Solution Approach 1:
The patent applies preliminary action by pre-forming the quantum dot film on the carrier substrate under controlled conditions before transfer to the LED chip. The quantum dots are dispersed in adhesive and cured on the carrier substrate in advance, allowing optimization of the dispersion and curing process for maximum humidity stability. This preliminary preparation ensures consistent quality before the transfer operation.
Solution Approach 2:
The carrier substrate acts as an intermediary that enables controlled formation of the quantum dot film with optimal humidity stability. The carrier substrate provides a stable platform for dispersing quantum dots in adhesive and curing them under controlled conditions. This intermediary role allows the quantum dot film to achieve better humidity stability during formation, which is then maintained during transfer to the LED chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process achieves uniform quantum dot distribution, improved light emission, and enhanced stability, reducing the thickness of the light emitting device while maintaining performance and longevity.
Implementation Method 1
disposing a first water-oxygen barrier layer on a surface of the substrate layer; disposing a second water-oxygen barrier layer on a surface of the light conversion layer far away from the substrate layer
Implementation Method 2
disposing a thermally conductive layer on at least one surface of the light conversion layer
Implementation Method 3
disposing a first transparent adhesive layer on an exposed surface of the LED chip
Implementation Method 4
curing the first transparent adhesive layer to realize the bonding between the quantum dot film and the first transparent adhesive layer
Data Source
AI summary
This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.