Quantum Dot Ink Adhesion via Silane Polymer Hydrogen Bonds
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Solution Overview
Problem
Existing quantum dot ink materials suffer from poor adhesion to substrates, insufficient mechanical properties, and lack of self-repair performance after curing and forming a film.
Innovation Solution
A quantum dot ink comprising a quantum dot material, a functional aid, and a low-molecular-weight silicon polymer, where the low-molecular-weight silicon polymer enhances adhesion and mechanical properties through multiple hydrogen bond interactions, and imparts self-repair capabilities to the film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin materials such as acrylates are used in quantum dot ink, then the ink can be cured into a film, but the adhesion to substrate becomes poor and mechanical properties become insufficient
Solution Approach 1:
The patent combines resin materials with silane-modified polymers to create a composite ink formulation. The silane groups form crosslinked networks that enhance both adhesion to substrate and mechanical strength of the cured film, resolving the contradiction between these two properties.
Solution Approach 2:
The patent modifies the chemical structure of the polymer by introducing silane groups with specific molecular weights and crosslinking densities. By adjusting these parameters, the cured film achieves improved adhesion and mechanical properties while maintaining film formation capability.
2Reliability
If resin materials are cured into a film, then a continuous base material is formed, but the film lacks self-repair properties and is susceptible to irreversible damage
Solution Approach 1:
The patent introduces dynamic covalent bonds through silane crosslinking that can break and reform under stress. This dynamic characteristic enables the cured film to self-repair scratches and damage by reorganizing the crosslinked network, transforming a static brittle structure into a dynamically adaptive material.
Solution Approach 2:
The silane-modified polymer system undergoes sol-gel transition during curing, forming a three-dimensional crosslinked network. This phase transition creates a structure that maintains film integrity while enabling self-repair through reversible bond formation and reorganization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced quantum dot ink exhibits improved adhesion and mechanical properties, along with self-repair functionality, reducing the impact of external damage such as scratching on the cured film.
Implementation Method 1
the low-molecular-weight silicon polymer enhances adhesion and mechanical properties through multiple hydrogen bond interactions
Implementation Method 2
Quantum dot materials have great potential in the display field by virtue of their excellent luminescence properties
Data Source
AI summary
The present application provides a quantum dot ink and a display terminal. Components of the quantum dot ink include a low-molecular-weight silicon polymer which includes three organosilicon group directly connected to a nitrogen atom and each independently containing a silicon-oxygen bond as a skeleton and containing an amide or ester branched chain, such that the interaction of multiple hydrogen bonds in the low-molecular-weight silicon polymer is used to enhance the adhesion of the quantum dot ink after curing into a film, and meanwhile, the film is provided with self-repair properties.