Quantum Dot Optical Component Laser Encapsulation
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Solution Overview
Problem
Conventional methods for manufacturing quantum dot optical components, such as filling quantum dots into glass tubes and encapsulating with heat, result in defects and are not suitable for display devices with narrow bezel structures due to uneven encapsulation, limiting their application and increasing manufacturing costs.
Innovation Solution
A method involving forming quantum dot lines on a substrate, encapsulating them with an organic and inorganic layer, and cutting the substrates to create smooth quantum dot optical components, which simplifies the process, reduces costs, and allows for simultaneous production of multiple components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If quantum dots are filled into glass tubes and encapsulated with heat, then the quantum dot optical component is manufactured, but defects occur in the encapsulation process and the surface is not smooth
Solution Approach 1:
The patent changes the encapsulation method from heat-based to laser-based, altering the physical parameter of energy delivery. The laser exposure process cures the frit material precisely without the thermal damage and unevenness caused by conventional heat encapsulation, resulting in defect-free and smooth surfaces.
Solution Approach 2:
The patent replaces the mechanical/thermal encapsulation system with an optical system. Instead of using heat to encapsulate the quantum dots in glass tubes, the invention uses laser exposure to cure the frit material, substituting a mechanical/thermal process with an optical one that provides better precision and surface quality.
2Adaptability or versatility
If conventional heat encapsulation is used, then quantum dot optical components are manufactured, but the encapsulation area is not smooth and cannot be applied to narrow bezel structures
Solution Approach 1:
The patent changes the encapsulation method from heat-based to laser-based, altering the physical parameter of energy delivery. The laser exposure process cures the frit material precisely without the thermal damage and unevenness caused by conventional heat encapsulation, resulting in defect-free and smooth surfaces.
Solution Approach 2:
The patent replaces the mechanical/thermal encapsulation system with an optical system. Instead of using heat to encapsulate the quantum dots in glass tubes, the invention uses laser exposure to cure the frit material, substituting a mechanical/thermal process with an optical one that provides better precision and surface quality.
3Ease of manufacture
If glass tubes are used for encapsulation, then quantum dot optical components are manufactured, but the process is complex and costly
Solution Approach 1:
The patent extracts and eliminates the glass tube component from the encapsulation process. Instead of filling quantum dots into glass tubes and then encapsulating them, the invention directly forms the quantum dot lines on the substrate and encapsulates only the necessary areas, removing the redundant glass tube step and simplifying the overall manufacturing process.
Solution Approach 2:
The patent changes the encapsulation method from heat-based to laser-based, altering the physical parameter of energy delivery. The laser exposure process cures the frit material precisely without the thermal damage and unevenness caused by conventional heat encapsulation, resulting in defect-free and smooth surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of quantum dot optical components with smooth surfaces, improving color reproduction in display devices by converting light into various colors, and enhances manufacturing efficiency and productivity.
Implementation Method 1
a quantum dot line (714) formed on the first substrate (712)... The quantum dot line may convert a wavelength of incident light... The quantum dot luminous-body may convert a wavelength of incident light
Implementation Method 2
forming an encapsulation member (716) that encapsulates the quantum dot lines (714)... an encapsulation member configured to encapsulate the quantum dot line
Implementation Method 3
The frit may include a glass material that is cured by a laser exposure
Data Source
AI summary
A method of manufacturing a quantum dot optical component is provided. By the method, a plurality of quantum dot lines are formed on a first substrate, an encapsulation member that encapsulates the quantum dot lines is formed on the first substrate, a second substrate is laminated on the encapsulation member, and the first and second substrates are cut into a plurality of quantum dot optical components each including at least one of the quantum dot lines.