Quantum Dot Light Control Layer with Thinned Partitions

The patent applies preliminary action by forming preliminary partition parts with a first thickness before applying the quantum dot solution. These preliminary partition parts serve as a temporary structure that defines the pixel boundaries during manufacturing. After the quantum dot solution is applied and the base resin is removed, the preliminary partition parts are removed entirely, leaving only the necessary light control layer structure. This preliminary structure enables precise quantum dot separation without requiring thick permanent partition parts that would absorb light.

The patent extracts the unnecessary portion of partition parts by removing the preliminary partition parts after they have served their initial purpose of defining pixel boundaries during manufacturing. The final partition structure is minimized to only the essential light control layer, extracting the excessive material that would otherwise absorb light and reduce brightness while maintaining the necessary quantum dot separation function.

The preliminary partition parts with first thickness serve as a temporary mold or boundary structure during the quantum dot solution application process. They ensure that the quantum dot solution is confined to the correct pixel regions before the final structure is formed. After the light control layer is formed and the base resin is removed, these preliminary partition parts are removed, leaving the quantum dots properly positioned without requiring thick final partition structures.

The patent changes the thickness parameter of the partition structure dynamically during the manufacturing process. The preliminary partition parts have a first thickness sufficient to contain the quantum dot solution during application, but this thickness is not carried over to the final structure. The final partition parts have a reduced second thickness that minimizes light absorption while the quantum dot separation function is maintained through the light control layer structure itself.

The patent utilizes phase transition by removing the base resin through volatilization or evaporation. The base resin is chosen to be volatile under the processing conditions, allowing it to be removed as a gas phase, which simplifies the removal process compared to solid or liquid removal methods. This phase transition approach enables clean removal of the base resin without leaving residues that would complicate subsequent processing steps.

The patent replaces complex mechanical removal methods with a chemical or physical field-based approach. Instead of using mechanical scraping or multiple washing steps, the base resin is removed through volatilization, which is a physical phase change process. This substitution simplifies the manufacturing process by eliminating the need for complex mechanical removal systems and reduces the risk of damaging the underlying structures during removal.