Quantum Dot LED Package Structure for Blue Light Conversion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED chip manufacturing and usage face inefficiencies in light emission and wavelength conversion, particularly in enhancing blue light scattering and absorption effects.
Innovation Solution
The method involves forming quantum dot material layers around LED chips and applying blue light scattering or absorbing material layers on these quantum dot layers to increase wavelength conversion efficiency, with the option to replace the scattering layer with an absorbing layer for further efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional LED chips are used without additional light management layers, then the device complexity is low, but the wavelength conversion efficiency is insufficient
Solution Approach 1:
The patent implements a nested multi-layer structure where the quantum dot material layer is enclosed within the blue light scattering material layer. The LED chip is positioned at the center, surrounded by the quantum dot layer which converts blue light to other wavelengths, and further surrounded by the scattering layer that redirects blue light back through the quantum dot layer, creating a nested configuration that maximizes light conversion efficiency
Solution Approach 2:
The patent combines multiple materials with different optical properties: the LED chip emits blue light, the quantum dot material layer converts blue light to other wavelengths through photoluminescence, and the blue light scattering material layer redirects blue light. This composite structure integrates materials with complementary functions to achieve enhanced overall wavelength conversion efficiency
2Productivity
If blue light scattering material layer is added to increase scattering effect, then the wavelength conversion efficiency increases, but the manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by first forming the quantum dot material layer around the LED chip, then subsequently forming the blue light scattering material layer on top of it. This sequential manufacturing approach allows each layer to be optimized independently and simplifies the overall fabrication process compared to attempting to create the complex structure in a single step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances blue light scattering and absorption, directly increasing wavelength conversion efficiency by scattering or absorbing blue light, thereby improving LED package structure performance.
Implementation Method 1
a blue light scattering effect of the present disclosure can be increased by using the blue light scattering material layer 4, thereby directly increasing a wavelength conversion efficiency of a blue light passing through the quantum dot material layer 3
Implementation Method 2
by virtue of 'the quantum dot material layer 3 for enclosing the LED chip 1' and 'the blue light scattering material layer 4 being disposed on the quantum dot material layer 3', a blue light scattering effect of the present disclosure can be increased by using the blue light scattering material layer 4
Implementation Method 3
the blue light scattering material layer 4 can be replaced by a blue light absorbing material layer for increasing a blue light absorbing effect, so that a possibility of the blue light passing through the blue light absorbing material layer can be reduced and the wavelength conversion efficiency provided by the quantum dot material layer 3 can be indirectly increased
Data Source
AI summary
An LED package structure and a method of manufacturing the same, and an LED display are provided. The method of manufacturing the LED package structure includes: providing a plurality of LED chips, each of the LED chips having two exposed conductive pads; forming a plurality of quantum dot material layers for respectively enclosing the LED chips; and respectively forming a plurality of blue light scattering material layers on the quantum dot material layers. The LED package structure includes the LED chip that has the two exposed conductive pads, the quantum dot material layer for enclosing the LED chip, and the blue light scattering material layer that is disposed on the quantum dot material layer.