Quantum Dot Packaging Layer for OLED Moisture Sealing

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Solution Overview

Problem

Traditional packaging methods for organic electroluminescence elements, such as OLEDs, fail to effectively seal against moisture and oxygen, leading to reduced lifespan and suboptimal color gamut, especially for flexible OLEDs, due to material limitations and compatibility issues with electrodes.

Innovation Solution

A package structure incorporating a quantum dot packaging layer made of inorganic materials like zinc oxide, graphene, or cadmium-based quantum dots, which forms a compact, water-oxygen resistant layer using an imprint method to cover the organic electroluminescence element, enhancing sealing performance and optical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional packaging methods are used for OLEDs, then the packaging process is simple, but the sealing performance against moisture and oxygen is insufficient

Engineering Contradiction:
Improvesealing performanceVSAvoidpackaging structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs a composite packaging structure combining organic packaging layers with inorganic quantum dot packaging layers. The quantum dot material (e.g., CdSe, CdS, ZnS) forms an inorganic barrier layer that provides superior moisture and oxygen sealing performance compared to traditional organic-only packaging, while maintaining flexibility and compatibility with the OLED structure.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The quantum dot packaging layer is formed as a thin film that can conform to flexible OLED substrates. This enables the packaging to provide effective sealing against moisture and oxygen while maintaining the flexibility required for flexible OLED applications, overcoming the limitation of rigid traditional packaging.

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If traditional packaging materials are used, then the packaging process is straightforward, but the color gamut performance is suboptimal

Engineering Contradiction:
Improvecolor gamutVSAvoidpackaging process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The quantum dot material's optical properties are utilized to enhance color gamut. By selecting specific quantum dot compositions (CdSe, CdS, ZnS) and controlling their size and structure, the packaging layer contributes to improved color performance while the imprint method provides a manufacturable process.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The quantum dot packaging layer serves as an intermediary between the OLED and the external environment, providing both protective sealing and optical enhancement functions. This single layer simultaneously addresses sealing performance and color gamut requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Duration of action of moving object

If flexible OLEDs are used, then thinness and flexibility are achieved, but packaging sealing against moisture and oxygen becomes more difficult

Engineering Contradiction:
ImproveOLED lifespanVSAvoidpackaging structure complexity
Core Design Contradiction:
Duration of action of moving objectVSDevice complexity

Solution Approach 1:

The combination of organic packaging layers with inorganic quantum dot layers creates a composite barrier structure that provides superior moisture and oxygen sealing. This composite approach extends OLED lifespan for flexible devices while maintaining structural simplicity through the integration of multiple functional layers.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The quantum dot packaging layer is implemented as a flexible thin film that can conform to bent and flexible OLED substrates. This enables effective sealing against moisture and oxygen in flexible OLED applications without compromising the flexibility or requiring complex rigid packaging structures.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS10854686B2Package structure consisting of quantum dot material and packaging method for organic electroluminescence element and display device
Publication Date: 2020.12.01 CHONGQING BOE OPTOELECTRONICS
  • US10854686B2 patent drawing
  • US10854686B2 patent drawing
  • US10854686B2 patent drawing

AI summary

A package structure and packing method for an organic electroluminescence element and an organic electroluminescence device are provided. The package structure for the organic electroluminescence element includes: a substrate, an organic electroluminescence element, and a quantum dot packaging layer. The organic electroluminescence element is disposed on the substrate, the quantum dot packaging layer is disposed on the substrate and the organic electroluminescence element, and consists of a quantum dot material.