Quantum Dot Device Packages With Gate Control

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Solution Overview

Problem

Current quantum computing technologies face challenges in achieving strong spatial localization and control over quantum dots, scalability, and flexible electrical connections, which are essential for effective quantum logic operations and integration into larger computing devices.

Innovation Solution

The development of quantum dot devices with a quantum well stack, gates disposed above the stack, and conductive pathways for precise control and manipulation of quantum dots, enabling strong spatial localization and scalable integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If quantum dots are used for quantum computing, then quantum mechanical phenomena can be utilized for computation, but strong spatial localization and control over quantum dots is challenging

Engineering Contradiction:
Improvecontrol over quantum dotsVSAvoidspatial localization complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The device is segmented into distinct functional regions: quantum well stacks for quantum dot formation, gate structures for control, and contact regions for electrical connection. This segmentation allows independent optimization of each region, improving quantum dot control while managing spatial localization complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from two-dimensional quantum well structures to three-dimensional quantum dot formations within the wells. This dimensional change enables strong spatial localization of quantum states, improving control and reliability for quantum computing operations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If quantum dot devices are developed for quantum computing, then quantum logic operations can be performed, but scalability to larger computing devices is difficult

Engineering Contradiction:
Improvequantum logic operations capabilityVSAvoidscalability
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The quantum well stack and gate structure design is made universal and modular, allowing identical units to be replicated and scaled. This universality enables systematic expansion from small-scale quantum logic operations to larger computing devices while maintaining consistent performance characteristics.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The device structure employs nested arrangements where quantum dots are formed within quantum wells, which are themselves part of a larger scalable device architecture. This nesting enables hierarchical scaling, where multiple quantum dot units can be integrated into progressively larger computing systems.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Adaptability or versatility

If quantum dot devices are created, then quantum mechanical phenomena can be harnessed, but flexible electrical connections for integration into larger devices are needed

Engineering Contradiction:
Improveelectrical connections flexibilityVSAvoidintegration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Contact regions and conductive pathways are introduced as intermediary elements between the quantum well stacks and external circuitry. These intermediaries provide flexible electrical connections that facilitate integration into larger quantum computing devices while managing the complexity of direct quantum component connections.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10756202B2Quantum dot device packages
Publication Date: 2020.08.25 INTEL CORP
  • US10756202B2 patent drawing
  • US10756202B2 patent drawing
  • US10756202B2 patent drawing

AI summary

Disclosed herein are quantum dot device packages, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device package may include a die having a quantum dot device, wherein the quantum dot device includes a quantum well stack, gates disposed above the quantum well stack, and conductive pathways coupled between associated ones of the gates and conductive contacts of the die. The quantum dot device package may also include a package substrate, wherein conductive contacts are disposed on the package substrate, and first level interconnects are disposed between the die and the package substrate, coupling the conductive contacts of the die with associated conductive contacts of the package substrate.