Quantum Dot Encapsulation Pockets via Segmented Barrier Layers
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Solution Overview
Problem
Existing methods for encapsulating quantum dots to protect them from oxygen and water vapor degradation are complex, expensive, and prone to edge ingress issues, limiting their large-scale and reliable deployment in applications like lighting and display.
Innovation Solution
A method to prepare pockets comprising encapsulated material, where core material (such as quantum dots) is fully surrounded by a barrier material encapsulation, formed through a process involving substrate preparation, core material deposition, and lid formation using photocurable resins and localized curing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multilayer barrier encapsulation is applied to protect quantum dots from oxygen and water vapor, then protection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The encapsulation structure is segmented into distinct functional layers: a base layer applied first, followed by core material, then a lid layer. This segmentation allows each layer to be optimized independently and simplifies the overall manufacturing process compared to complex multilayer structures.
Solution Approach 2:
The base layer acts as an intermediary between the substrate and the core material, providing a foundation that facilitates subsequent lid formation. This intermediary structure enables simplified encapsulation without requiring complex multilayer deposition sequences.
2Reliability
If multilayer barrier encapsulation is applied to protect quantum dots from oxygen and water vapor, then protection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The encapsulation process is divided into sequential steps (base layer application, core material deposition, lid formation) that can be performed using standard, cost-effective techniques rather than expensive successive deposition methods.
Solution Approach 2:
The encapsulation structure uses readily available, cost-effective materials for the base and lid layers that provide sufficient protection without requiring expensive specialized materials or complex manufacturing equipment.
3Ease of manufacture
If thin film encapsulation is applied to protect quantum dots, then ease of manufacture is improved, but edge ingress occurs compromising protection
Solution Approach 1:
The encapsulation is segmented into a base layer and a separate lid layer that overlaps the base layer edges. This segmentation prevents edge ingress by ensuring the lid extends beyond the base material edges, creating an overlapping seal that blocks contaminant access.
Solution Approach 2:
The lid layer is extended in the lateral dimension beyond the base material edges, creating an overlapping configuration. This dimensional extension prevents edge ingress by providing a secondary barrier that covers the edges of the base layer.
4Device complexity
If quantum dots are deposited directly on blue LED chip, then device complexity is reduced, but local heating accelerates quantum dot degradation
Solution Approach 1:
The device structure is segmented to separate the quantum dot-containing encapsulation from the LED chip, introducing an intermediate substrate layer. This segmentation allows thermal management while maintaining structural simplicity.
Solution Approach 2:
An intermediate substrate serves as a mediator between the LED chip and the quantum dot encapsulation, providing thermal isolation that protects the quantum dots from excessive heating while maintaining device structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents edge ingress and eliminates the need for successive multilayer deposition, resulting in a simpler, cost-effective, and reliable encapsulation process that maintains the integrity of quantum dots over extended periods.
Implementation Method 1
forming one or more bases B of barrier material on a substrate by a1. applying barrier material b comprising a resin... a2. locally curing the barrier material b to form one base B or a plurality of bases B
Implementation Method 2
quantum dots are typically encapsulated... gas diffusion barriers need to be implemented... barrier material encapsulation
Data Source
Figure 1(i)~1(viii)
Figure 2
Figure 3~5
AI summary
The invention relates to a method to prepare pockets comprising encapsulated material. The pockets are formed by first forming one or more bases B of barrier material on a substrate, by subsequently applying core material on at least part of the bases B and by forming a lid L on basesB provided with core material. The core material comprises at least one photoemissive particle or photoemissive compound such as quantum dots. The invention also relates to a pocket or a plurality of pockets comprising encapsulated material obtained by such method, to a device comprising at least one pocket of encapsulating material and to a process to transfer such a pocket of encapsulated material from one substrate to another substrate.