Quantum Dot Devices With Trenched Substrates For Spatial Localization

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Solution Overview

Problem

Current quantum computing technologies face challenges in achieving strong spatial localization and control over quantum dots, scalability, and design flexibility for integrating quantum dot devices in larger computing systems.

Innovation Solution

The development of quantum dot devices with trenched substrates, where a quantum well stack is partially disposed in a trench with a different material at the bottom, allowing for precise control of quantum dots and electrical connections through gates and doped regions, enabling strong spatial localization and scalability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If quantum dots are implemented using classical computing devices, then the device structure is simple and易于制造, but strong spatial localization and control over quantum dots cannot be achieved

Engineering Contradiction:
Improvespatial localization precisionVSAvoiddevice structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate is segmented by creating trenches that divide it into isolated regions. Each trench contains a quantum well stack that is spatially separated from others, enabling independent control and strong localization of quantum dots within each trench while maintaining a relatively simple overall device structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different properties through the trench structure. The trench regions contain quantum well stacks with specific materials and doping configurations that provide localized control over quantum dot formation and properties, while the surrounding substrate maintains its original characteristics.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If quantum dot devices are designed with full integration control, then spatial localization is improved, but scalability to larger computing systems becomes difficult

Engineering Contradiction:
Improvequantum dot control precisionVSAvoidscalability
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The trench substrate design creates a universal platform that can accommodate multiple quantum dot devices with identical structures. Each trench functions as an independent unit that can be replicated across the substrate, allowing precise control within each unit while enabling scalable integration of many such units into larger computing systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The device structure employs nested organization where quantum dots are contained within quantum well stacks, which are in turn contained within trenches in the substrate. This hierarchical nesting allows precise control at the quantum dot level while maintaining scalability through the modular trench structure that can be extended across large substrate areas.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Adaptability or versatility

If quantum dot devices lack design flexibility, then manufacturing is simpler, but integration into larger computing systems is limited

Engineering Contradiction:
Improvedesign flexibilityVSAvoidmanufacturing simplicity
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The device incorporates doped regions with adjustable doping concentrations and types (n-type or p-type) that can be dynamically configured to create different electrical environments. This allows the same basic trench structure to be adapted for various quantum dot device configurations and functions while maintaining a consistent manufacturing process.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The design allows modification of key parameters such as doping concentration, doping type, trench depth, and quantum well stack composition to optimize device performance for different applications. These parameter changes can be made within the same fundamental device architecture, providing design flexibility without requiring complete redesign of the manufacturing process.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11721737B2Quantum dot devices with trenched substrates
Publication Date: 2023.08.08 INTEL CORP
  • US11721737B2 patent drawing
  • US11721737B2 patent drawing
  • US11721737B2 patent drawing

AI summary

Disclosed herein are quantum dot devices with trenched substrates, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a substrate having a trench disposed therein, wherein a bottom of the trench is provided by a first material, and a quantum well stack at least partially disposed in the trench. A material of the quantum well stack may be in contact with the bottom of the trench, and the material of the quantum well stack may be different from the first material.