Quantum Dot Unit Wire Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display apparatuses with quantum dot units face efficiency decreases at high temperatures due to inadequate heat dissipation, limiting design and performance, and increasing manufacturing costs with indirect heat dissipation methods.
Innovation Solution
Incorporating a quantum dot unit with a glass fiber having a hollow, where quantum dots are accommodated, and a wire with high thermal conductivity extending beyond the glass fiber to connect to a heat dissipation member, allowing direct heat dissipation and maintaining efficient light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If indirect heat dissipation method is used for quantum dot unit, then heat dissipation is achieved, but efficiency of quantum dot unit decreases at high temperature and manufacturing costs increase
Solution Approach 1:
The patent extracts the heat dissipation function from the indirect cooling method and implements it directly through wire structures that extend into the quantum dot unit. The wire penetrates the encapsulation layer and makes direct thermal contact with the quantum dots, extracting heat directly from the heat source rather than through intermediate components.
Solution Approach 2:
The wire acts as a thermal intermediary between the quantum dot unit and the heat dissipation structure. By using materials with high thermal conductivity, the wire efficiently transfers heat from the quantum dots through the encapsulation layer to external heat dissipation components, improving the thermal coupling without compromising the optical encapsulation.
2Temperature
If indirect heat dissipation method is used for quantum dot unit, then heat dissipation is achieved, but manufacturing costs increase due to additional components
Solution Approach 1:
The wire structure serves multiple functions simultaneously: it provides electrical connection, mechanical support, and thermal conduction pathways. By integrating heat dissipation into existing structural components rather than adding separate dedicated cooling components, the patent reduces overall device complexity and manufacturing costs.
Solution Approach 2:
The patent merges the heat dissipation function with existing structural elements of the quantum dot unit. The wire that is already present for electrical connection or structural purposes is utilized as a thermal conduction pathway, combining multiple functions into a single component and eliminating the need for additional dedicated heat dissipation components.
3Temperature
If wire with high thermal conductivity is inserted into hollow of glass fiber, then direct heat dissipation is achieved, but light transmission efficiency may be affected
Solution Approach 1:
The wire is positioned specifically within the hollow core of the glass fiber where it does not interfere with the primary light transmission path. By confining the thermal conduction element to a localized region (the hollow core) and using materials with appropriate optical properties, the patent achieves effective heat dissipation while maintaining high light transmission efficiency in the surrounding regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance, maintains light efficiency, and reduces manufacturing costs by effectively managing temperature and light conversion within the quantum dot unit.
Implementation Method 1
at least one wire between the plurality of quantum dots... a wire with high thermal conductivity extending beyond the glass fiber to connect to a heat dissipation member
Implementation Method 2
a quantum dot unit disposed on a light path between the light source and the display panel and including a plurality of quantum dots
Data Source
AI summary
There is provided a display apparatus and a method of manufacturing the same. The display apparatus includes: a quantum dot unit or a quantum dot sheet capable of improving heat dissipation performance. A wire with high heat transfer rate is provided in the quantum dot unit or the quantum dot sheet, and the wire is connected to the bottom chassis of the display apparatus so as to dissipate heat generated in the quantum dot.