Quantum Interposer with Cap Wafer for Thermal Isolation
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Solution Overview
Problem
Current quantum computing architectures face challenges in maintaining qubit device performance, controlling coupling between qubits, reducing unwanted cross-coupling, achieving thermal isolation, and minimizing microwave loss, particularly in large-scale quantum processors.
Innovation Solution
The development of cap wafer architectures with via designs that provide thermal isolation, shield electromagnetic fields, and control coupling between qubits, along with interposers for scalable and robust quantum computing systems, which include superconducting materials and structures to suppress electromagnetic radiation and enhance coherence times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If superconducting qubits are implemented in large-scale quantum processors, then computational capability is improved, but unwanted cross-coupling between qubits increases
Solution Approach 1:
The patent divides the quantum processor into modular units called quantum processing cells, each containing isolated qubits. This segmentation allows independent control and reduces unwanted cross-coupling between qubits in different cells, while still enabling large-scale computational capability through the network of cells.
Solution Approach 2:
The patent introduces coupler devices as intermediary elements between qubits. These couplers act as controlled mediators that enable desired quantum interactions between specific qubits while preventing unwanted direct coupling, thus managing cross-coupling effects in large-scale processors.
2Device complexity
If quantum circuits are integrated on substrate, then device complexity is reduced, but thermal isolation becomes difficult to achieve
Solution Approach 1:
The patent segments the quantum circuit into multiple layers including a first substrate layer, a second substrate layer, and intermediate layers. This segmentation allows thermal management by creating thermal pathways through specific vias while maintaining electrical isolation where needed, thus achieving thermal isolation without excessive complexity.
Solution Approach 2:
The patent introduces intermediate layers and via structures as mediators between the first and second substrate layers. These intermediaries provide controlled thermal pathways (through thermally conductive vias) and electrical isolation (through insulating structures), enabling thermal management in integrated quantum circuits.
3Duration of action of moving object
If electromagnetic shielding is added to quantum circuits, then coherence time is improved, but device complexity increases
Solution Approach 1:
The patent merges the electromagnetic shielding function with the existing substrate and interlayer structures. The first and second substrates themselves serve as shielding layers, and the intermediate layers provide additional shielding, combining structural support with electromagnetic protection to reduce coherence time degradation without adding separate shielding components.
Solution Approach 2:
The patent designs the substrate and intermediate layers to serve multiple functions: mechanical support, electrical isolation, thermal management, and electromagnetic shielding. This multi-functionality provides coherence time protection through shielding without increasing device complexity, as the same structures perform multiple protective and functional roles.
4Temperature
If via structures are added for thermal isolation, then thermal management is improved, but microwave loss increases
Solution Approach 1:
The patent applies different via structures in different locations: thermally conductive vias are used where thermal isolation is needed, while superconducting vias are used in microwave signal paths to minimize microwave loss. This local differentiation optimizes both thermal management and microwave performance by matching via properties to local requirements.
Solution Approach 2:
The patent changes the material parameters of vias based on their function: using materials with high thermal conductivity for thermal isolation vias, and superconducting materials with low microwave loss for signal transmission vias. This parameter optimization allows thermal management without excessive microwave loss by selecting appropriate material properties for each via's specific role.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These solutions improve qubit device performance by extending coherence times, reducing unwanted coupling, and minimizing microwave loss, enabling more efficient and reliable operation in large-scale quantum computing systems.
Implementation Method 1
vias containing normally-conducting metals (e.g., copper) may operate as excellent heat sinks for for superconducting signal lines
Implementation Method 2
The disclosed cap wafers may also shield electromagnetic field leakage
Implementation Method 3
interposers for scalable and robust quantum computing systems, which include superconducting materials and structures to suppress electromagnetic radiation and enhance coherence times
Data Source
AI summary
A quantum computing apparatus, including a quantum circuit device; and an interposer including a connectorization layer including a plurality of terminals for connecting the quantum computing apparatus to a corresponding plurality of cables and a plurality of signal lines electrically coupled, via electrical contacts, to the plurality of terminals; and at least one intermediate layer between the quantum circuit device and the connectorization layer, the at least one intermediate layer comprising an integrated circuit layer, the at least one intermediate layer being electrically coupled to the signal lines of the interposer. The interposer is configured to supply the quantum circuit device, during operation of the quantum computing apparatus, at least control signals and readout signals to and from the plurality of cables.