Quantum Chip Interposer Layout for Cryogenic Cooling and Terminal Density
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Solution Overview
Problem
Existing quantum devices face limitations in cooling performance due to the restricted number of terminals available for wiring, which hinders the efficient cooling of quantum chips to the required temperatures for optimal operation.
Innovation Solution
A quantum device design that includes a quantum chip mounted on an interposer with conductive wiring lines, where the interposer has distinct areas for wiring and movable members that contact a sample stage with a cooling function, allowing for improved heat dissipation and terminal utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the interposer surface is used for cooling by heat conduction with the sample stage, then the cooling function is improved, but the number of terminals that can be led to the outside is limited
Solution Approach 1:
The interposer surface is segmented into distinct functional areas: a first area for conductive wiring lines and terminals, and a second area for heat conduction with the sample stage. This spatial segmentation allows simultaneous optimization of both terminal availability and cooling performance without interference between the two functions.
Solution Approach 2:
Different regions of the interposer are assigned different functional properties: the first area is optimized for electrical connectivity with conductive wiring lines, while the second area is optimized for thermal conduction with the sample stage. This local differentiation of quality enables each region to perform its specific function efficiently.
2Reliability
If the quantum chip is cooled to a predetermined temperature, then the quantum chip performance is improved, but the number of terminals must be increased
Solution Approach 1:
The interposer surface is divided into functional zones that separate terminal functions from cooling functions. This segmentation allows the quantum chip to be cooled effectively through the second area while the first area provides sufficient terminal capacity for wiring connections.
Solution Approach 2:
The solution moves from a one-dimensional constraint (using the entire interposer surface for either terminals or cooling) to a two-dimensional functional distribution, where different areas of the interposer surface serve different purposes simultaneously, increasing overall system capability.
3Quantity of substance
If more terminals are added to the interposer, then the number of terminals is increased, but the cooling function deteriorates
Solution Approach 1:
The interposer is segmented into dedicated terminal areas and dedicated cooling areas. This allows terminals to be concentrated in the first area without compromising the thermal conduction capability of the second area, thereby increasing terminal count while preserving cooling function.
Solution Approach 2:
The interposer exhibits local quality differentiation where the first area has high electrical conductivity for terminals while the second area has high thermal conductivity for cooling. This local optimization allows each function to be maximized in its designated region without negatively affecting the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling performance while maintaining or increasing the number of terminals, preventing electrical short circuits and ensuring efficient heat flow, thus enabling the quantum chip to operate effectively at low temperatures.
Implementation Method 1
the quantum chip is cooled by heat conduction with the sample stage through the interposer
Data Source
AI summary
A quantum device according to an example embodiment includes a quantum chip 10, and an interposer 20 on which the quantum chip 10 is mounted, in which the interposer 20 includes a conductive wiring line CL1 electrically connected to the quantum chip 10, a mounting surface 21 of the interposer 20 on which the quantum chip 10 is mounted or an opposite surface 22 opposite to the mounting surface 21 includes a first area AR11 and a second area AR12 different from the first area AR11 as viewed in a direction perpendicular to the mounting surface 21 or the opposite surface 22, the conductive wiring line CL1 is disposed in the first area AR11 on the mounting surface 21 or the opposite surface 22, and a movable member 60 is in contact with the second area AR12 of the interposer 20.