Quantum Interposer Assembly Without PCB Bonding Failures
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Solution Overview
Problem
Traditional qubit chip assemblies require multiple bonding operations, which can lead to mechanical failures due to thermal expansion coefficient mismatches between the interposer chip and the PCB, and non-superconducting components in PCBs cause signal losses in quantum circuits.
Innovation Solution
Directly coupling an interposer chip to electrical connectors without a PCB, using superconducting transmission lines and enclosures with pressure connections to establish a secure and efficient electrical link between qubit chips and connectors, while shielding against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a PCB is used to couple the interposer chip to electrical connectors, then the assembly provides mechanical support and electrical connection, but thermal expansion coefficient mismatches cause bonding failures
Solution Approach 1:
The patent removes the PCB from the assembly, extracting the source of thermal expansion mismatches and bonding failures. The interposer chip is directly coupled to electrical connectors without requiring a PCB substrate, thereby eliminating the reliability issues associated with thermal expansion coefficient differences between the interposer chip and PCB.
Solution Approach 2:
The patent merges the functions of the interposer chip and electrical connectors by directly coupling them together. This integration eliminates intermediate bonding interfaces that would be susceptible to thermal stress, reducing the number of potential failure points while maintaining both mechanical support and electrical connection functions.
2Reliability
If a PCB is used in the quantum circuit assembly, then electrical connection is established, but non-superconducting components cause signal losses
Solution Approach 1:
The patent extracts and removes the PCB from the quantum circuit assembly, eliminating non-superconducting components that cause signal losses. By directly coupling the interposer chip to electrical connectors, the design removes sources of electromagnetic interference and resistive losses, thereby improving signal integrity for quantum circuits.
3Ease of manufacture
If multiple bonding operations are performed to assemble the qubit chip assembly, then components are connected, but mechanical failures occur due to thermal expansion mismatches
Solution Approach 1:
The patent merges the interposer chip and electrical connectors into a directly coupled assembly, reducing the number of separate bonding operations required. This consolidation decreases the total number of bonding interfaces that could fail due to thermal expansion mismatches, thereby improving mechanical stability while simplifying the assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of bonding operations, minimizes mechanical failures, and maintains signal integrity by using superconducting materials for efficient electrical communication and shielding, thereby enhancing the reliability and performance of quantum circuits.
Implementation Method 1
The interposer chip can comprise a superconducting transmission line coupling the qubit chip to the contact pad
Implementation Method 2
The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip
Implementation Method 3
the qubit chip enclosure lid can further comprise a pressing device positioned on the first side of the qubit chip enclosure lid
Implementation Method 4
shielding a qubit chip of the qubit chip assembly from electromagnetic interference via an isolation barrier that extends from the qubit chip enclosure lid
Data Source
AI summary
Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.