Flip-Chip Quantum Interposer Layout for Slot Line Leakage Suppression
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Solution Overview
Problem
The deformation or destruction of air bridges on quantum chips during flip-chip mounting leads to insufficient suppression of energy leakage modes, such as the slot line mode, resulting in degraded performance of quantum bits.
Innovation Solution
A quantum device design featuring a quantum chip flip-chip mounted on an interposer with a conductor configuration that includes a coplanar line, a center conductor, first and second ground electrodes, and connection electrodes to maintain equal potential across ground electrodes, mimicking the function of an air bridge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an air bridge is formed on the quantum chip to suppress slot line mode, then energy leakage is reduced, but the air bridge is deformed or destroyed during flip-chip mounting
Solution Approach 1:
The ground electrode pattern is designed on the interposer substrate before flip-chip mounting to pre-establish the electrical connection path that will maintain ground potential equality after mounting, eliminating the need for post-mounting air bridge formation
Solution Approach 2:
The interposer substrate acts as an intermediary component between quantum chips, providing a stable platform with pre-formed ground electrode patterns that mediate the electrical connection and maintain ground potential without requiring fragile air bridge structures
2Loss of energy
If the ground plane is kept at the same voltage to suppress slot line mode, then energy leakage is suppressed, but the wiring complexity increases and arrangement space is consumed
Solution Approach 1:
The ground electrode pattern is merged into the interposer substrate structure itself, combining the functions of mechanical support, electrical connection, and ground potential maintenance into a single integrated component
Solution Approach 2:
The interposer substrate serves multiple functions simultaneously: providing mechanical support for quantum chips, establishing electrical connections through bump electrodes, maintaining ground potential equality, and suppressing slot line mode, thereby reducing overall system complexity
Data Source
AI summary
Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).