Quantum processing circuitry cooling systems and methods
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Solution Overview
Problem
Current cryogenic cooling architectures for quantum processing circuitry are limited by the need to position components close to the cryocooler, restricting scalability and cooling power, especially for systems requiring millions of qubits.
Innovation Solution
A modular cryogenic cooling system with independent pressure chambers and thermal links using cryofluid conduits and heat exchangers allows for flexible positioning of quantum processing circuitry components, enabling efficient cooling and scaling by providing independent cooling sources and control over cooling power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If quantum processing circuitry components are positioned close to the cryocooler to maximize conductive cooling power, then cooling efficiency is improved, but device scalability and flexibility are worsened
Solution Approach 1:
The patent introduces cryofluid as an intermediary cooling medium between the cryocooler and quantum processing circuitry components. The cryofluid circulates through conduits and heat exchangers, transferring thermal energy without requiring direct physical contact or proximity between the cryocooler and quantum components. This mediator enables flexible system architecture where components can be positioned independently while maintaining effective thermal coupling.
2Power
If traditional conductive cooling architecture is used with components positioned close to the cryocooler, then cooling power is maximized, but system complexity and difficulty of expansion are worsened
Solution Approach 1:
The patent segments the cooling system into modular components: a cryocooler unit, separate quantum processing circuitry modules, and an independent cryofluid circulation system with multiple heat exchangers. Each module can be independently designed, positioned, and scaled. The cryofluid circulation system acts as a distributed thermal management network, allowing incremental expansion of quantum components without redesigning the entire cooling architecture.
3Productivity
If quantum processing circuitry is scaled to millions of qubits, then computational capability is improved, but cooling power requirements and system complexity increase
Solution Approach 1:
The patent creates a universal cryofluid-based thermal management platform that can serve multiple quantum processing modules simultaneously. The circulation system with heat exchangers can be configured to cool different types of quantum components (qubits, control electronics, readout systems) at various locations. This multi-functional approach allows scalable expansion to millions of qubits using a standardized cooling infrastructure rather than requiring dedicated cooling for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the scalability and efficiency of quantum processing circuitry cooling, allowing for the maintenance of cryogenic conditions necessary for quantum computers with thousands or millions of qubits while minimizing noise and vibrations.
Implementation Method 1
a cooler configured to generate and/or store cryofluid
Implementation Method 2
a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger
Implementation Method 3
a plurality of thermal couplings between the cooler and the device
Data Source
AI summary
Quantum processing circuitry cooling systems are provided. The systems can include: a first chamber maintained at a first pressure; a second chamber maintained at a second pressure, wherein the first and second pressures are independent from one another; a cooler within the first chamber and operable to act as a cooling source for the cooling system; and quantum processing circuitry within the second chamber, the quantum processing circuitry being thermally coupled to the cooler. Cooling systems are also provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are also provided. The methods can include providing cooling to quantum processing circuitry from a cooling source in a chamber having an independent pressure from the pressure about the quantum processing circuitry.