Quantum Processor Packaging with Shielded Ridge and Cavity
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Solution Overview
Problem
Existing packaging arrangements for quantum processors face challenges in efficiently distributing operation signals and maintaining desired operating conditions, particularly as the number of qubits increases, leading to complex signal distribution and increased susceptibility to electromagnetic disturbances.
Innovation Solution
A packaging arrangement featuring a PCB attachment plate with a conductive material, an attachment plate cavity, and a ridge to support the quantum processor chip, which includes openings for adhesive and trenches to prevent excessive adhesive from reaching the chip surfaces, along with a chip cover plate for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the number of qubits is increased, then the computational power is improved, but the signal distribution complexity and susceptibility to electromagnetic disturbances increase
Solution Approach 1:
The packaging arrangement is divided into distinct functional segments: a PCB for signal routing, a conductive attachment plate for mounting, a cavity structure for shielding, and a cover plate for additional protection. This segmentation allows each component to address specific aspects of the complexity problem, making the overall system more manageable despite increased qubit count
Solution Approach 2:
The patent implements nested shielding structures where the quantum processor chip is mounted on a ridge within a cavity formed in the conductive attachment plate, which itself is mounted on the PCB. The cavity and cover plate create nested enclosed spaces that provide multi-layer electromagnetic shielding, addressing the increased susceptibility to disturbances that comes with higher qubit counts
2Power
If the number of qubits is increased, then the computational power is improved, but the susceptibility to electromagnetic disturbances increases
Solution Approach 1:
The patent implements nested shielding structures where the quantum processor chip is mounted on a ridge within a cavity formed in the conductive attachment plate, which itself is mounted on the PCB. The cavity and cover plate create nested enclosed spaces that provide multi-layer electromagnetic shielding, addressing the increased susceptibility to disturbances that comes with higher qubit counts
Solution Approach 2:
The conductive materials and shielding structures, which might seem to add complexity, actually convert the harmful electromagnetic disturbances into contained fields that do not interfere with the quantum processor, transforming the threat into a protected environment
3Object-affected harmful factors
If a conductive packaging arrangement is used for shielding, then electromagnetic protection is improved, but resonances may occur at control signal frequencies
Solution Approach 1:
The cavity is designed with specific local geometric properties - its dimensions and shape are tailored to push resonance frequencies above the control signal band. The ridge structure and opening size are specifically configured to achieve this frequency separation, ensuring that the shielding function is maintained without creating harmful resonances at operational frequencies
4Ease of operation
If a ridge structure is added to support the quantum processor chip, then alignment and assembly are simplified, but the device complexity increases
Solution Approach 1:
The ridge structure serves multiple functions simultaneously: it provides mechanical support for the quantum processor chip, establishes precise alignment features, creates a mounting surface for adhesive application, and contributes to the overall shielding geometry. By consolidating these functions into a single structural element, the patent reduces the number of separate components needed, thereby managing complexity while improving ease of assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed packaging arrangement enhances signal distribution efficiency, improves alignment and assembly of quantum processor components, and effectively shields the quantum processor from electromagnetic interference, thereby maintaining optimal operating conditions even with increasing numbers of qubits.
Implementation Method 1
The attachment plate cavity in the PCB attachment plate increases the resonance frequency in an effective resonant cavity formed between a quantum processor chip received on the ridge and a bottom of the attachment plate cavity.
Implementation Method 2
The quantum processor is sensitive to electromagnetic disturbance and should preferably be shielded. Thermal radiation and magnetic fields are particularly challenging to overcome.
Data Source
AI summary
A packaging arrangement (100) for a quantum processor chip (101) comprising a PCB attachment plate (120) of a conductive material. The PCB attachment plate is arranged to receive a printed circuit board, PCB, (110) in a stacked configuration where the PCB faces a first surface of the PCB attachment plate. The PCB attachment plate (120) comprises an attachment plate cavity (121) on the first surface, and comprises a ridge (122) arranged at least partly surrounding the attachment plate cavity and arranged protruding from the first surface. wherein the ridge is arranged to receive the quantum processor chip (101).