Quantum Processor RF Interconnects With Coplanar Ground Ring
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Solution Overview
Problem
Existing methods for transmitting and receiving high-frequency signals to and from qubits in quantum processors face challenges such as signal loss and heating due to the requirement of a grounded substrate.
Innovation Solution
The use of coplanar waveguides with a ground ring surrounding the signal paths on a quantum processor die, which is mounted on a low-doped silicon carrier substrate, to minimize signal loss and heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microstrips are used to transmit and receive high-frequency signals to and from qubits, then signal transmission is achieved, but signal loss and heating occur due to the requirement of a grounded substrate
Solution Approach 1:
The invention extracts the ground plane requirement from the traditional microstrip design by implementing coplanar waveguides where all conductors (signal and ground) reside on the same surface layer. This eliminates the need for a grounded substrate below the qubits, thereby reducing signal loss and heating while maintaining signal transmission capability.
Solution Approach 2:
The invention transitions from a three-dimensional microstrip structure (with ground plane below) to a two-dimensional coplanar configuration where signal and ground conductors are arranged on the same surface plane. This dimensional change allows for better thermal management and reduced signal loss by eliminating the grounded substrate requirement.
2Device complexity
If a grounded substrate is used below the qubits, then signal transmission structure is simplified, but signal loss and heating increase
Solution Approach 1:
The invention removes the grounded substrate component from the traditional microstrip architecture by using coplanar waveguides where ground conductors are placed on the same surface as signal conductors. This extraction eliminates the harmful interaction between the ground plane and qubits, reducing signal loss and heating while maintaining structural simplicity.
3Loss of energy
If coplanar waveguides with ground ring are used, then signal loss and heating are reduced, but device complexity increases
Solution Approach 1:
The invention merges the signal and ground conductors onto the same surface plane in a coplanar configuration, with the ground ring surrounding the signal path. This integration reduces the need for separate grounded substrates and minimizes the number of layers required, thereby reducing signal loss and heating while keeping the overall device complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient transmission and reception of high-frequency signals with reduced signal loss and heating, thereby improving the performance and reliability of quantum processors.
Implementation Method 1
coplanar waveguides carrying high-frequency radiofrequency or microwave signals
Implementation Method 2
a ground ring surrounds the signal paths to improve the ground connections
Implementation Method 3
The carrier substrate for the quantum processor die can be any suitable material such as low-doped silicon, which can improve the mechanical structure of a wafer when manufactured
Data Source
AI summary
Technologies for radiofrequency optimized interconnects for a quantum processor are disclosed. In the illustrative embodiment, signals are carried in coplanar waveguides on a surface of a quantum processor die. A ground ring surrounds the signals and is connected to the ground conductors of each coplanar waveguide. Wire bonds connect the ground ring to a ground of a circuit board. The wire bonds provide both an electrical connection from the quantum processor die to the circuit board as well as increased thermal coupling between the quantum processor die and the circuit board, increasing cooling of the quantum processor die.