Integrated Quantum Sensor Structure With Lateral Waveguide Coupling

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Solution Overview

Problem

Conventional quantum sensors are large in size and their constituent elements are not scalable, limiting their deployment in various applications, particularly in biomedical applications.

Innovation Solution

A photonic device structure comprising a first and second waveguide core laterally coupled to a sensor layer with defect centers capable of photoluminescence, integrated with a photodetector, allowing for high-sensitivity detection of physical quantities like magnetic fields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional quantum sensor structures are used, then high sensitivity detection is achieved, but the device size becomes large and scalability is limited

Engineering Contradiction:
Improvedetection sensitivityVSAvoidsensor size
Core Design Contradiction:
Measurement precisionVSVolume of moving object

Solution Approach 1:

The patent transitions from conventional three-dimensional bulk sensor structures to a two-dimensional photonic integrated circuit platform. The sensor layer with defect centers is integrated laterally between waveguide cores in a planar configuration, enabling compact scaling while maintaining quantum sensing capabilities through optical waveguide coupling rather than traditional volumetric structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple functional elements into a single integrated photonic device: waveguide cores for light transport, a sensor layer with defect centers for quantum sensing, and photodetectors for signal readout are merged into one compact structure. This integration eliminates the need for separate bulky components while maintaining high sensitivity detection through efficient optical coupling between the merged elements.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If conventional quantum sensor structures are used, then high sensitivity detection is achieved, but device complexity and difficulty of scaling increase

Engineering Contradiction:
Improvedetection sensitivityVSAvoidstructural complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The photonic integrated circuit structure serves multiple functions simultaneously: waveguide cores transport optical signals, the sensor layer with defect centers performs quantum sensing, and photodetectors readout the signals. This multi-functional integration reduces the number of separate components and simplifies the overall system architecture while maintaining high sensitivity detection capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent replaces conventional mechanical or electrical sensor structures with an optical-based photonic system. Light propagation through waveguides and interaction with defect centers in the sensor layer enables sensing without complex mechanical moving parts or electrical connections, thereby reducing structural complexity and improving scalability to multiple channels.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure enables compact, scalable quantum sensors capable of sensitive detection, facilitating their deployment in diverse applications including biomedical uses.

Implementation Method 1

the sensor layer comprises a material including a plurality of defect centers capable of photoluminescence

Methodology Applied
Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS20250347861A1Structures for a quantum sensor
Publication Date: 2025.11.13 GLOBALFOUNDRIES US INC
  • US20250347861A1 patent drawing
  • US20250347861A1 patent drawing

AI summary

Structures for a quantum sensor and methods of forming such structures. The structure comprises a first waveguide core, a second waveguide core, and a sensor layer laterally between the first waveguide core and the second waveguide core. The first waveguide core is laterally coupled to the sensor layer, the second waveguide core is laterally coupled to the sensor layer, and the sensor layer comprises a material including a plurality of defect centers capable of photoluminescence.