Quantum Socket Assembly for Cryogenic Contact Stability
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Solution Overview
Problem
Existing quantum devices face issues with electrical connections becoming disconnected due to thermal shrinkage caused by differences in linear expansion coefficients of materials at low temperatures, leading to cumulative errors and displacement of contacts.
Innovation Solution
The quantum device incorporates a design where the housing and board substrate include integrally formed fixing parts and body parts, ensuring uniform contraction and reducing displacement by using materials with similar linear expansion coefficients, and integrating them with a cooling base for stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If different materials with different linear expansion coefficients are used for the socket housing and board substrate, then the device can be manufactured with standard materials, but thermal shrinkage causes cumulative errors and electrical connection disconnection at low temperatures
Solution Approach 1:
The patent applies homogeneity by making the fixing part and body part integrally formed from the same material, ensuring uniform linear expansion coefficients throughout the socket structure. This eliminates differential thermal shrinkage between separate components, preventing cumulative errors and maintaining electrical connection stability at low temperatures.
Solution Approach 2:
The patent merges the fixing part and body part into a single integrally formed component. This consolidation eliminates the interface between separate parts, preventing relative displacement caused by differential thermal contraction and ensuring reliable electrical connections throughout the temperature range.
2Ease of manufacture
If the socket housing is made from a single material, then manufacturing is simplified, but the linear expansion coefficient difference with the board substrate causes thermal shrinkage errors
Solution Approach 1:
The patent applies homogeneity by using the same material for both the fixing part and body part, creating a uniform structure with consistent thermal expansion properties. This eliminates internal differential shrinkage that would occur with composite materials, maintaining contact position accuracy despite temperature changes.
3Adaptability or versatility
If separate fixing parts and body parts are used in the socket, then assembly flexibility is improved, but the difference in linear expansion coefficients causes cumulative thermal shrinkage errors
Solution Approach 1:
The patent merges the fixing part and body part into a single integrally formed component. This eliminates the interface between separate parts where differential thermal shrinkage would cause cumulative errors, while the integral design maintains sufficient assembly flexibility through the overall socket structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents disconnection of electrical contacts by uniformly managing thermal expansion, maintaining stable connections and reducing errors, thereby enhancing the reliability of quantum devices at extreme temperatures.
Implementation Method 1
a superconductive element including a superconductive material
Implementation Method 2
when the temperature is low, a difference between a linear expansion coefficient of a socket housing which is most thermally shrinkable
Data Source
AI summary
A quantum device capable of preventing contacts from being displaced is provided. A quantum device includes a quantum element in which a quantum circuit is provided, a socket including contacts and a housing, the contacts being in contact with a terminal of the quantum element, and the housing supporting the contacts, and a board including a board substrate. At least one of the housing and the board substrate includes a hole, another one of the housing and the board substrate includes a fixing part disposed inside the hole and a body part other than the fixing part, and the fixing part and the body part are integrally formed.