Cryogenic Quantum Chip Socket With Movable Pins for Terminal Reliability
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Solution Overview
Problem
Quantum devices face the risk of terminal disconnection due to stress and strain caused by volume changes during cooling, and the limited number of external connection terminals in existing quantum devices.
Innovation Solution
A quantum device design featuring a socket with movable pins and a housing that allows for relative movement with the interposer and sample stage, ensuring electrical contact is maintained despite volume changes, and incorporating a sample stage with a cooling function to manage thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the quantum device is cooled to extremely low temperature, then the quantum chip can operate in superconducting state, but the terminals may be disconnected due to stress and strain from volume change
Solution Approach 1:
The socket is designed with a movable pin that can move relative to the housing along the direction of thermal stress. This dynamic structure allows the pin to adjust its position in response to volume changes during cooling, maintaining continuous electrical contact with the interposer terminal despite thermal contraction and stress.
Solution Approach 2:
The movable pin's position parameter changes in response to temperature-induced volume changes. As the quantum device cools and contracts, the pin moves to accommodate the dimensional changes, ensuring that the electrical connection parameter (contact continuity) remains stable across the temperature range.
2Temperature
If one surface of the interposer is used for cooling contact, then the quantum chip can be cooled effectively, but the number of external connection terminals is limited
Solution Approach 1:
The electrical connection is extended to a second surface of the interposer that is opposite to the cooling contact surface. The socket and movable pin are positioned on this opposite surface, allowing external connections to be made without interfering with the cooling contact area, thereby increasing the number of available external terminals.
Solution Approach 2:
The interposer is functionally segmented into a cooling surface and an opposite surface for electrical connections. This spatial segmentation allows independent optimization of both cooling efficiency and terminal availability, as each surface serves its dedicated function without constraining the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents terminal disconnection and secures external connections by accommodating volume changes, while increasing the number of usable terminals for data transfer.
Implementation Method 1
there is a risk that a contact with a terminal for external connection is disconnected (e.g., broken) due to a stress and a strain caused by the change in volume during the cooling process
Implementation Method 2
In order to use such a quantum device in a superconducting state, it is necessary to cool the quantum device to an extremely low temperature
Data Source
AI summary
A quantum device capable of securing terminals for external connection is provided. A quantum device according to an example embodiment includes a quantum chip 10, an interposer 20 on which the quantum chip 10 is mounted, and a socket 40 disposed so as to be opposed to the interposer 20, the socket 40 comprising a movable pin 47 and a housing 45 supporting the movable pin 47, in which at least one end of the movable pin 47, which includes the one end and the other end opposite to the one end, is movable relative to the housing 45, the one end being in electrical contact with a terminal of the interposer 20, and the other end is in an electrical contact with a terminal of a board 50 on which a connector 51 is formed, the connector 51 being configured to serve as an external input/output.