Quantum Chip Socket Shielding for Electromagnetic Noise Control
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Solution Overview
Problem
Quantum devices face issues with electromagnetic noise affecting qubit circuits, which can degrade their performance.
Innovation Solution
A quantum device configuration with a quantum chip mounted on an interposer, a socket housing the chip with a recessed unit covered by a metal surface, and a board connected via terminals, where the socket and interposer are designed to minimize electromagnetic interference and facilitate efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the quantum chip is mounted on an interposer with a socket, then electrical connections are established, but electromagnetic noise is applied to the qubit circuit
Solution Approach 1:
The patent introduces a ground wire as an intermediary element between the socket and the quantum chip. This ground wire acts as a mediator that provides a reference potential and shields the signal transmission path, thereby reducing electromagnetic noise while maintaining reliable electrical connections. The ground wire is specifically positioned to connect the socket's ground terminal to the quantum chip's ground pad, creating a noise-resistant electrical pathway.
Solution Approach 2:
The patent creates an electromagnetic shielding environment by surrounding the signal transmission path with ground wires and grounding structures. This forms an 'inert' electromagnetic environment that isolates the qubit circuit from external electromagnetic interference, similar to how an inert atmosphere protects chemical reactions from unwanted environmental interactions.
2Ease of operation
If the socket is disposed to face the first wiring layer, then electrical connections are facilitated, but electromagnetic interference increases
Solution Approach 1:
The patent applies different structural qualities to different parts of the socket assembly. The signal terminals are positioned for easy electrical connection, while ground terminals are strategically placed and connected via ground wires to provide localized electromagnetic shielding. This local differentiation allows the socket to simultaneously achieve ease of connection and resistance to electromagnetic interference.
Solution Approach 2:
The patent employs asymmetric arrangement of terminals in the socket, with ground terminals and signal terminals positioned differently. The ground wires are asymmetrically routed to provide optimal shielding for signal paths. This asymmetric design breaks the symmetry of electromagnetic field distribution, reducing interference while maintaining connection effectiveness.
3Reliability
If multiple terminals are used for electrical connection, then connection reliability improves, but device complexity increases
Solution Approach 1:
The patent designs the socket with multi-functional terminals that serve both electrical connection and electromagnetic shielding purposes. The ground terminals, in addition to providing reference potential, also function as part of the shielding structure. This multi-functionality reduces the need for separate shielding components, thereby limiting the increase in device complexity while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields the qubit circuit from electromagnetic noise, maintains reliable electrical connections, and ensures efficient cooling, thereby enhancing the stability and performance of the quantum device.
Implementation Method 1
the recessed unit has a first metal surface covering at least a part of the quantum chip
Data Source
AI summary
A quantum device includes a quantum chip, an interposer including a first wiring layer over which the quantum chip is mounted, a socket disposed to face the first wiring layer and including a plurality of terminals, and a board having a second wiring layer facing the first wiring layer. Each of the plurality of terminals electrically connects the first wiring layer and the second wiring layer, the socket includes a recessed unit housing the quantum chip, and the recessed unit has a first metal surface covering at least a part of the quantum chip.