Quantum Well Intermixing Sacrificial Layer

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Solution Overview

Problem

Existing quantum well intermixing methods often result in poor surface morphology and material quality, which negatively impact the performance of semiconductor optoelectronic devices like laser diodes due to the introduction of defects and impurities during the interdiffusion process.

Innovation Solution

A method of quantum well intermixing that involves applying a sacrificial layer and a QWI enhancing layer, such as tungsten nitride, to create regions with enhanced and suppressed interdiffusion, allowing for controlled band gap shifts without introducing impurities, using a silicon nitride and silicon oxide suppressing layer to maintain surface integrity and minimize defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If quantum well intermixing is performed using conventional methods, then band gap modification is achieved, but surface morphology and material quality deteriorate due to defects and impurities

Engineering Contradiction:
Improveband gap modification precisionVSAvoidsurface morphology quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

A sacrificial layer (e.g., GaAs) is introduced as an intermediary between the quantum well structure and the QWI enhancing layer. This sacrificial layer absorbs the harmful effects of the intermixing process, preventing defects and impurities from forming in the quantum well region. After QWI, the sacrificial layer is removed, leaving a clean interface without contamination.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial layer is designed to be temporary and disposable - it serves its protective function during the QWI process and is then completely removed. This disposable layer enables the use of aggressive QWI conditions (high temperature, long duration) that would otherwise damage the quantum well, while leaving no residual impurities.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Manufacturing precision

If high temperature annealing is applied for sufficient time to achieve interdiffusion, then band gap shift is enhanced, but surface morphology and material quality deteriorate

Engineering Contradiction:
Improveband gap shift controlVSAvoidmaterial quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The QWI enhancing layer (e.g., tungsten nitride, silicon nitride) acts as a mediator that enables high-temperature annealing without direct exposure of the quantum well to damaging conditions. These layers facilitate atomic interdiffusion through controlled diffusion barriers, achieving the desired band gap shift while protecting the quantum well material from degradation.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If QWI enhancing layers are applied to promote interdiffusion, then band gap modification is improved, but impurity introduction occurs

Engineering Contradiction:
Improveband gap modificationVSAvoidimpurity introduction
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The QWI enhancing layer serves as a mediator that promotes interdiffusion through its specific material properties (e.g., diffusion barrier characteristics, thermal stability) rather than by introducing impurities. The layer enables controlled atomic exchange between quantum well and barrier materials through thermal annealing without contaminating the semiconductor structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The method changes the physical and chemical parameters of the interface region through the enhancing layer - specifically, it modifies the diffusion characteristics and thermal stability of the quantum well/barrier interface. This enables controlled interdiffusion at elevated temperatures without introducing foreign impurities into the active region.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively modifies band gaps in semiconductor wafers, enhancing the performance of laser diodes by achieving significant band gap shifts while maintaining good surface morphology and material quality, resulting in improved reliability and output power.

Implementation Method 1

annealing at a temperature sufficient to cause interdiffusion of atoms between the quantum well layer and barrier layers

Methodology Applied
Scientific EffectInterdiffusion: Diffusion

Implementation Method 2

forming a QWI enhanced region and a QWI suppressed region by applying a QWI enhancing layer over a portion of the sacrificial layer

Methodology Applied
Scientific EffectSelective interdiffusion: Diffusion Barrier

Data Source

PatentUS7723139B2Quantum well intermixing
Publication Date: 2010.05.25 THORLABS QUANTUM ELECTRONICS INC
  • US7723139B2 patent drawing
  • US7723139B2 patent drawing
  • US7723139B2 patent drawing

AI summary

Embodiments of a method of quantum well intermixing (QWI) comprise providing a wafer comprising upper and lower epitaxial layers, which each include barrier layers, and a quantum well layer disposed between the upper and lower epitaxial layers, applying at least one sacrificial layer over the upper epitaxial layer, and forming a QWI enhanced region and a QWI suppressed region by applying a QWI enhancing layer over a portion of the sacrificial layer, wherein the portion under the QWI enhancing layer is the QWI enhanced region, and the other portion is the QWI suppressed region. The method further comprises the steps of applying a QWI suppressing layer over the QWI enhanced region and the QWI suppressed region, and annealing at a temperature sufficient to cause interdiffusion of atoms between the quantum well layer and the barrier layers of the upper epitaxial layer and the lower epitaxial layer.