Quartz Crystal Bonding Layout for Stable Acceleration Sensitivity
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Solution Overview
Problem
Conventional quartz crystal devices with pedestals bonded at four points exhibit variations in acceleration sensitivity characteristics due to the number and positioning of bonding points, leading to deteriorated performance.
Innovation Solution
A quartz crystal device where the crystal element is bonded to a pedestal at four points, with a center line passing through the midpoints of the crystal element's short sides meeting a straight line connecting the center and each bonding point at an angle of 22° to 30°, reducing variation and enhancing acceleration sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the crystal element is bonded to the pedestal at four points, then the bonding strength and structural stability are improved, but the variation in acceleration sensitivity characteristics increases due to bonding position deviations
Solution Approach 1:
The patent applies local quality by optimizing the bonding position angles specifically at critical locations around the crystal element. By setting the bonding points at specific angles (first pair at 22°-30° and second pair at 57°-68° relative to the X-axis), the patent creates localized stress distribution patterns that compensate for manufacturing variations while maintaining overall bonding strength.
Solution Approach 2:
The patent changes the angular parameters of the bonding positions to resolve the contradiction. By specifying precise angle ranges (22°-30° and 57°-68°) instead of arbitrary positions, the patent transforms the bonding configuration into a parameter-optimized system that reduces acceleration sensitivity variation while preserving bonding strength through mathematical optimization of stress distribution.
2Ease of manufacture
If the bonding points are positioned at arbitrary angles, then the manufacturing process is simpler, but the acceleration sensitivity characteristics deteriorate due to angle variation
Solution Approach 1:
The patent introduces specific angular parameters (22°-30° and 57°-68°) to define bonding positions, transforming an arbitrary process into a parameter-controlled one. This maintains manufacturing simplicity by using standard bonding procedures while significantly improving reliability through optimized angle specifications that reduce acceleration sensitivity variation.
Solution Approach 2:
The patent replaces reliance on mechanical precision of bonding position with a mathematically optimized angular configuration. By using specific angle ranges rather than requiring precise mechanical positioning, the patent substitutes mechanical complexity with geometric optimization, achieving both ease of manufacture and improved reliability.
3Reliability
If the bonding angle is optimized to 25°-28°, then the acceleration sensitivity characteristics are improved, but the bonding position control becomes more critical
Solution Approach 1:
The patent applies local quality by creating an optimized bonding zone at specific angular positions (25°-28° and corresponding symmetric positions). This localized angular optimization reduces acceleration sensitivity variation while the patent mitigates manufacturing precision requirements by providing a range (25°-28°) rather than a single critical value, allowing tolerances.
Solution Approach 2:
The patent performs preliminary optimization of the bonding angle parameters before the actual bonding process. By pre-calculating and specifying the optimal angle range (25°-28°), the patent eliminates the need for post-bonding adjustments or complex real-time control, reducing manufacturing precision requirements while maintaining improved acceleration sensitivity characteristics.
Data Source
AI summary
A quartz crystal device includes a package, a pedestal, and a crystal element. The pedestal is disposed in the package. The crystal element is bonded to the pedestal at four points. An angle formed by a center line connecting midpoints of both short sides of the crystal element and a straight line connecting a center point of the center line and each of bonding points is 22° or more and 30° or less.