Quartz Clip Device With Expanded Holes Prevents Cracking
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Solution Overview
Problem
The existing quartz clip devices for OLED high-temperature ovens are prone to cracking due to slight vibrations causing the quartz posts to tip and contact with the bottom board, leading to temperature inhomogeneity and potential damage during high-temperature processing.
Innovation Solution
A quartz clip device with circular holes in the bottom board having a diameter expanded according to the formula D=d+2h*arctan(α), where d is the quartz post diameter, h is the height of the upper plate, and α is the maximum tipping angle, to prevent contact-induced cracking and maintain temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the quartz posts are tightly fitted to the bottom board to prevent excessive tipping, then the stability of the quartz posts is improved, but the risk of contact-induced cracking increases due to vibration and temperature changes
Solution Approach 1:
The patent applies beforehand cushioning by designing a clearance between the quartz posts and the bottom board, and by rounding the corners of the bottom board. The clearance prevents direct contact that would cause cracking, while the rounded corners eliminate stress concentration points. This anticipates the vibration and thermal expansion issues before they occur, allowing the quartz posts to move slightly without causing damage.
Solution Approach 2:
The patent changes the geometric parameters of the bottom board, specifically rounding the corners with a radius R and creating a clearance distance a between the quartz posts and the board edges. These parameter changes transform the rigid contact structure into a flexible design that accommodates vibration and thermal effects, preventing cracking while maintaining stability.
2Reliability
If the corners of the bottom board are rounded to prevent cracking, then the reliability is improved, but the temperature uniformity across the substrate may be affected
Solution Approach 1:
The patent applies local quality by rounding only the corners of the bottom board while keeping the central area flat and intact. This localized modification prevents cracking at the stress-prone corners without affecting the overall temperature distribution across the substrate. The rounded corners provide stress relief locally, while the main heating area maintains its thermal uniformity.
3Productivity
If multiple substrates are heated simultaneously in the OLED high-temperature oven, then the productivity is improved, but the requirement for temperature consistency becomes more difficult to maintain
Solution Approach 1:
The patent applies segmentation by dividing the heating space into multiple levels or zones using the quartz clip device structure. The bottom board with its rounded corners and clearances provides stable support for multiple substrates at different positions, ensuring that each substrate receives consistent heat treatment. The segmented design allows simultaneous heating while maintaining temperature uniformity across all substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents cracking of the quartz bottom board and ensures temperature consistency during high-temperature processing, enhancing the reliability and efficiency of the OLED packaging process.
Implementation Method 1
blocking heat flowing between processes carried out above and below the quartz bottom board so as to ensure temperature consistency of each individual substrate on the quartz plates
Implementation Method 2
placed in an OLED high-temperature oven for baking to evaporate the organic solvents
Implementation Method 3
The OLED high-temperature oven that is used to bake the frit usually requires an extremely high temperature, such as being as high as 500-600° C.
Data Source
AI summary
The present invention provides a quartz clip device and a manufacturing method thereof and an OLED high-temperature oven having the quartz clip device. The quartz clip device includes: a base (20), a plurality of quartz posts (30) mounted on the base (20), a quartz bottom board (40) arranged above the base (20), and a plurality of quartz plates (50) arranged above the quartz bottom board (40) and secured to the quartz posts (30). The quartz bottom board (40) includes a plurality of circular holes (42) formed therein to respectively correspond to the quartz posts (30). The circular holes (42) have a diameter that is slightly greater than a diameter of the quartz posts (30). The quartz posts (30) are received through he circular holes (42) and fastening members (60) are provided under the circular holes (42) to have the quartz bottom board (40) supported on the quartz posts (30). Slightly enlarging the diameter of the circular holes of the quartz bottom board ensures slight tipping of the quartz posts does not result in contact with the quartz bottom board so as to prevent cracking of the quartz bottom board from being caused by the contacts and affecting the production.