Quartz Crystal Resonator Laser Step Processing
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Solution Overview
Problem
Conventional methods for manufacturing AT cut quartz crystal resonators face challenges such as difficulty in controlling shape during miniaturization, surface roughness, limited versatility, high production costs due to specialized equipment, and long processing times, especially when forming small quartz crystal pieces.
Innovation Solution
A method using a laser beam to alter the height of a crystal chip step-by-step, allowing for precise control of shape, efficient processing of various shapes, and reduced production time, with the option to use a laser oscillator emitting a laser beam with non-uniform intensity and a mask with a circular arc transmission section for improved convex shape formation, and immersion in corrosive liquids to remove processing dust.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If blasting is applied to manufacture AT cut quartz crystal resonators, then the convex sectional shape can be formed, but the shape control becomes difficult during miniaturization and surface roughness occurs
Solution Approach 1:
The patent replaces the mechanical blasting process with a laser beam processing system. The laser beam selectively removes material to form the convex sectional shape without the random impact forces of blasting, enabling precise shape control even during miniaturization while avoiding surface roughness.
Solution Approach 2:
The patent changes the processing parameters by using laser beam intensity and duration control instead of blasting force and duration. By adjusting laser power, scanning speed, and beam focus, the convex shape can be precisely controlled at various scales without compromising surface quality.
2Shape
If specialized equipment is used for manufacturing quartz crystal resonators, then the convex shape can be formed, but the production cost increases
Solution Approach 1:
The patent employs a laser oscillating system that can be integrated into existing manufacturing lines and used for multiple processing tasks. The same laser system can form convex shapes, trim electrodes, and process various crystal orientations, eliminating the need for specialized dedicated equipment and reducing overall production costs.
Solution Approach 2:
By replacing specialized mechanical blasting equipment with a versatile laser processing system, the patent reduces equipment investment and maintenance costs while achieving the same convex shape formation capability.
3Manufacturing precision
If conventional processing methods are used, then the crystal wafer can be processed, but the processing time is long
Solution Approach 1:
The patent uses a continuous laser beam scanning process to remove material and form the convex shape. The laser beam continuously processes the crystal wafer surface by scanning along predetermined paths, eliminating the intermittent nature of conventional step-by-step mechanical processing and significantly reducing processing time while maintaining thickness uniformity.
Solution Approach 2:
The laser processing system operates at much higher speeds than mechanical blasting or polishing methods. The non-contact laser beam can rapidly vaporize and remove material without the speed limitations of mechanical tool engagement, thereby increasing productivity without sacrificing precision.
4Volume of moving object
If the crystal chip size is reduced for miniaturization, then the resonator becomes smaller, but the shape control difficulty increases
Solution Approach 1:
The laser processing system provides superior control at micro-scales compared to mechanical blasting. The focused laser beam can be precisely positioned and controlled at the micrometer level, enabling accurate convex shape formation on miniaturized crystal chips without the shape control difficulties that arise when reducing size with mechanical methods.
Solution Approach 2:
The patent adjusts laser processing parameters such as beam diameter, power density, and scanning speed to match the reduced dimensions of miniaturized crystal chips. These parameter changes enable precise shape control at smaller scales by concentrating the energy delivery in a controlled manner appropriate for the reduced size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy control of shape, improved performance, reduced production costs, and the ability to form quartz crystal resonators with a small load, using versatile equipment and tools, effectively addressing the limitations of existing methods.
Implementation Method 1
applying a laser beam that is absorbed into a quartz crystal to an end of the crystal chip
Implementation Method 2
A method using a laser beam to alter the height of a crystal chip step-by-step
Implementation Method 3
immersion in corrosive liquids to remove processing dust
Data Source
AI summary
By applying a laser beam that is absorbed into a quartz crystal to an upper right end of a crystal chip, the height of the crystal chip is altered step by step to form a first step, a second step, a third step, and a fourth step, respectively. As such, control of the shape of a quartz crystal resonator is easy even if the quartz crystal resonator is miniaturized, the shape and the performance of a processed quartz crystal resonator are satisfactory, quartz crystal resonators of various shapes can be formed, a quartz crystal resonator can be formed at low cost with a small number of man-hours, a load in driving a quartz crystal resonator is small, and versatile equipment and tools can be used.