Quartz Oscillation Groove Sidewall Angles for Stable Yield
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Solution Overview
Problem
The challenge in manufacturing quartz oscillation devices is to improve the quality and reliability while reducing their size to meet the demands of lighter, thinner, and shorter electronic products, with the morphology of grooves or openings being a key factor affecting yield and performance.
Innovation Solution
The quartz oscillation device incorporates a quartz sheet with grooves or openings having an included angle of 60° to 90° between the sidewall and the surface, utilizing dry etching processes like RIE to control the angle and aspect ratio, minimizing side etching and enhancing consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the quartz oscillation device is reduced to meet lighter and thinner electronic products, then the device size is reduced, but the quality and reliability of the device deteriorate
Solution Approach 1:
The patent changes the geometric parameters of the groove structure by specifying precise sidewall angles (60° to 90°) and aspect ratio ranges. This parameter optimization allows the device to maintain structural integrity and performance reliability even when scaled down to smaller sizes, directly resolving the contradiction between size reduction and quality maintenance
2Ease of manufacture
If conventional etching processes are used to form grooves or openings, then the manufacturing process is simple, but the morphology control and manufacturing yield deteriorate
Solution Approach 1:
The patent specifies precise parameter ranges for the groove structure including sidewall angles (60° to 90°) and aspect ratios (0.5 to 2.0). These controlled parameters enable consistent morphology across manufacturing batches, significantly improving manufacturing precision and yield while maintaining process feasibility
Solution Approach 2:
The patent replaces conventional wet etching with dry etching processes. This substitution provides better control over groove morphology, sharper angle precision, and reduced side etching effects, thereby improving manufacturing precision without excessively complicating the manufacturing process
3Ease of manufacture
If the groove or opening morphology is not optimized, then the manufacturing process is straightforward, but the yield and performance of the quartz oscillation device deteriorate
Solution Approach 1:
The patent establishes specific parameter ranges for groove morphology including sidewall angles (60° to 90°) and aspect ratios (0.5 to 2.0). These optimized parameters directly improve manufacturing yield by ensuring consistent device performance and reducing defect rates, while the ranges are set broad enough to maintain manufacturing straightforwardness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved angle and etching method result in higher quality and reliability of the quartz oscillation devices by reducing breakage and cracks, ensuring consistent dimensions and improved manufacturing yield.
Implementation Method 1
utilizing dry etching processes like RIE to control the angle and aspect ratio
Data Source
AI summary
Disclosed is a quartz oscillation device including a quartz sheet, a first conductive layer and a second conductive layer. The first conductive layer is disposed on the first surface of the quartz sheet. The second conductive layer is disposed on the second surface of the quartz sheet. The quartz sheet has a groove or an opening penetrating therethrough. An included angle between a side wall of the groove or the opening and the first surface or the second surface is 60° to 90°.