Quartz Oscillator Etching Profile to Reduce Miniaturization Defects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As quartz oscillators shrink in size to meet the demand for thinner and smaller electronic products, manufacturing defects become more pronounced, affecting their quality and reliability.
Innovation Solution
A manufacturing method for quartz oscillators involving a stacked structure of first and second plates with a quartz sheet in between, utilizing a combination of wet and dry etching processes to create an asymmetrical etching profile, followed by a surface grinding process to reduce defects and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of quartz oscillators is reduced to meet the demand for thinner and smaller electronic products, then the adaptability to modern electronic devices is improved, but the manufacturing defects become more pronounced and reliability deteriorates
Solution Approach 1:
The patent applies asymmetry by creating a non-parallel configuration between the first outer surface, side surface, and first connection surface of the quartz oscillator. This asymmetric geometric design helps distribute stress more evenly and reduces the impact of manufacturing defects, thereby improving reliability while maintaining the reduced size required for modern electronic devices.
2Adaptability or versatility
If the size of quartz oscillators is reduced, then the adaptability to modern electronic devices is improved, but the manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The asymmetric configuration of surfaces (first outer surface, side surface, and first connection surface not being parallel) provides manufacturing tolerance that accommodates variations in the etching process, making it easier to achieve consistent quality at smaller sizes.
3Manufacturing precision
If wet etching process is used to create asymmetrical profile, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent combines wet etching and dry etching processes in a sequential manner to achieve the asymmetric profile. By merging these two etching methods, the patent accomplishes both the asymmetrical shape creation and surface quality improvement, managing the increased process complexity through systematic integration of multiple techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the quality and reliability of quartz oscillators by minimizing defects and cracks, ensuring consistent performance in smaller form factors.
Implementation Method 1
one of the first process and the second process includes a wet etching process
Implementation Method 2
followed by a surface grinding process to reduce defects and improve reliability
Data Source
AI summary
A quartz oscillator including a first plate, a second plate, and a quartz sheet is provided. The quartz sheet has an oscillation zone. The quartz sheet is disposed between the first plate and the second plate. The quartz oscillator has a first outer surface, a side surface, and a first connection surface. The first outer surface is located on the first plate. The first connection surface is located between the first outer surface and the side surface. The first outer surface, the side surface, and the first connection surface are not parallel to each other. A manufacturing method of a quartz oscillator is also provided.