Quartz Oscillator Groove Geometry for Breakage-Resistant Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in manufacturing quartz oscillators is to improve the quality and reliability while reducing their size to meet the demands of lighter, thinner, and shorter electronic products, with the morphology of grooves or openings being a key factor affecting yield and performance.
Innovation Solution
The quartz oscillator design incorporates a quartz sheet with grooves or openings having an included angle of 60° to 90° between the sidewall and the surface, utilizing dry etching processes like RIE to control the angle and aspect ratio, reducing breakage and enhancing consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the quartz oscillation device is reduced to meet lighter, thinner, and shorter electronic products, then the device size is reduced, but the quality and reliability of the quartz oscillator deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the included angle of the groove sidewall to a specific range (60° to 90°) and controlling the aspect ratio of the groove. These parameter optimizations enable the groove to be formed with high precision in smaller quartz sheets, thereby reducing device size while maintaining or improving quality and reliability. The specific angle range ensures proper stress distribution and structural integrity in miniaturized devices.
2Ease of manufacture
If the morphology of grooves or openings is not precisely controlled, then the manufacturing process is simpler, but the yield and quality of quartz oscillation devices deteriorate
Solution Approach 1:
The patent specifies precise parameter ranges for groove morphology, including an included angle of 60° to 90° and controlled aspect ratio. These parameter definitions provide clear manufacturing targets that balance ease of fabrication with high precision requirements, enabling consistent quality across production while maintaining manufacturability through well-defined geometric constraints.
Solution Approach 2:
The patent employs dry etching processes (such as RIE - Reactive Ion Etching) to form grooves with precise morphology. This replaces traditional mechanical cutting methods with a chemical etching process that offers superior control over groove shape, angle, and consistency, thereby achieving high manufacturing precision while maintaining reasonable ease of manufacture through standardized semiconductor fabrication techniques.
3Device complexity
If the included angle of the groove sidewall is not optimized, then the manufacturing process is less complex, but the breakage rate increases and consistency deteriorates
Solution Approach 1:
The patent optimizes the groove sidewall included angle to a specific range (60° to 90°) to balance structural strength and manufacturing feasibility. This angle optimization reduces stress concentration points that could lead to breakage during handling and operation, while also ensuring the groove can be efficiently formed using standard dry etching processes. The controlled aspect ratio further enhances consistency by preventing excessive groove depth that would increase breakage risk.
Data Source
AI summary
Disclosed is a quartz oscillator including a first cover, a second cover, and a quartz oscillation device. The quartz oscillation device is disposed between the first cover and the second cover. The quartz oscillation device includes a quartz sheet, a first conductive layer and a second conductive layer. The first conductive layer is disposed on the first surface of the quartz sheet. The second conductive layer is disposed on the second surface of the quartz sheet. The quartz sheet has a groove or an opening penetrating therethrough. An included angle between a side wall of the groove or the opening and the first surface or the second surface is 60° to 90°.