Quartz Glass Prepreg Composition for High-Frequency Substrate Workability
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Solution Overview
Problem
Existing semiconductor substrates face challenges with brittle quartz glass, which is difficult to process due to its high hardness, and lack effective dielectric properties for high-frequency applications, limiting their practical use in high-speed communication.
Innovation Solution
A prepreg composition using a thermosetting resin containing a modified polyphenylene ether compound, a first inorganic filler with a molybdenum compound on its surface, and a second inorganic filler, combined with a glass cloth containing quartz glass yarn, to enhance dielectric properties, heat resistance, and workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If quartz glass is used as the fibrous base material to achieve low dielectric properties and low thermal expansion, then electrical characteristics are improved, but the material becomes very brittle and difficult to process
Solution Approach 1:
The patent uses a composite fibrous base material consisting of quartz glass yarn combined with other glass fibers (such as E-glass or S-glass). This composite structure maintains the excellent dielectric properties and low thermal expansion of quartz glass while incorporating more processable glass fibers that improve brittleness and workability during substrate manufacturing processes like drilling and cutting.
2Reliability
If the content of the first inorganic filler is increased to improve dielectric properties, then electrical characteristics are enhanced, but the manufacturing precision and workability deteriorate
Solution Approach 1:
The patent optimizes the content of the first inorganic filler to a specific range (0.1-15 parts by weight per 100 parts by weight of thermosetting resin) to achieve the best balance between dielectric properties and workability. This parameter optimization ensures sufficient dielectric performance while maintaining adequate manufacturing precision and processing ease.
Solution Approach 2:
The patent introduces a second inorganic filler as an intermediary component that works synergistically with the first inorganic filler. The second filler helps to balance the mechanical properties and processing characteristics while the first filler provides the dielectric enhancement, thereby resolving the contradiction between electrical performance and manufacturability.
3Reliability
If a modified polyphenylene ether compound is used as the thermosetting resin to achieve low permittivity and low dielectric loss tangent, then high-frequency electrical characteristics are improved, but the heat resistance and moldability may be compromised
Solution Approach 1:
The patent creates a composite thermosetting resin system by combining modified polyphenylene ether compound with specific inorganic fillers (first and second inorganic fillers). This composite resin system maintains the excellent high-frequency dielectric properties of the modified PPE while the inorganic fillers provide enhanced heat resistance and dimensional stability, preventing the compromise of thermal performance.
Data Source
AI summary
One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.