Quartz Vibration Structure With Recess Isolation Against Leakage
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Solution Overview
Problem
Existing quartz crystal vibrators in wafer-level packaging face challenges in maintaining the integrity of vibration performance due to the integration of the vibration portion with the frame portion, leading to potential leakage of vibration and instability.
Innovation Solution
A vibration device design where the vibration portion is separated from the frame portion by a recess, allowing for independent support and stabilization, with the entire periphery of the vibration portion being joined to the outer peripheral region of the recess, and utilizing a common material for both components to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the vibration portion is connected to the frame portion, then the vibration portion is supported by the package, but vibration leakage occurs and stability deteriorates
Solution Approach 1:
The intermediate layer is divided into a vibration portion and a frame portion that are separated from each other. The vibration portion is positioned over the recess in the base substrate, while the frame portion surrounds the vibration portion but does not connect to it. This segmentation prevents vibration leakage from occurring at the connection interface between the vibration portion and frame portion, while maintaining structural support through the package assembly.
2Object-generated harmful factors
If the vibration portion is separated from the frame portion, then vibration leakage is reduced, but manufacturing complexity increases
Solution Approach 1:
The vibration portion and frame portion are formed as an integrated intermediate layer through a single semiconductor substrate processing step, followed by a separation process that divides the layer into the two functional regions. This merging approach simplifies manufacturing by reducing the number of separate components and assembly steps, while still achieving the vibration isolation benefit of separation.
3Adaptability or versatility
If different materials are used for the vibration portion and frame portion, then functional optimization is improved, but manufacturing precision deteriorates
Solution Approach 1:
The intermediate layer is formed from a single semiconductor substrate material, ensuring homogeneous composition and consistent manufacturing properties throughout both the vibration portion and frame portion. This homogeneous material basis simplifies the manufacturing process and ensures precise dimensional control, while the functional differentiation is achieved through geometric configuration rather than material composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces vibration leakage and enhances the stability of the quartz crystal vibrator, improving its performance characteristics and design flexibility.
Implementation Method 1
The vibration portion includes an excitation portion at which the excitation electrode is located
Data Source
AI summary
A vibration device includes: first and second substrates; an intermediate layer; and an excitation electrode. The first substrate includes a first surface. The second substrate includes a second surface facing the first surface. The intermediate layer is located between the first and second surfaces. The first surface includes a first recess. The intermediate layer includes a vibration portion and a frame portion. The vibration portion includes an excitation portion at which the excitation electrode is located. The excitation portion faces the first recess. The frame portion surrounds the vibration portion and is joined to the first and second surfaces. The frame portion includes a layer of the same material as included in the vibration portion. An entire periphery of an outer edge of the vibration portion is away from the frame portion. The vibration portion is joined to an outer peripheral region of the first recess on the first surface.