Quartz Resonator Chip Chamfering to Minimize Edge Cracks
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Solution Overview
Problem
The issue of cracks exceeding 5 μm at cutting edges of quartz resonators during the shrinking process affects the reliability of quartz oscillators, leading to fragmentation under external forces.
Innovation Solution
A manufacturing method involving two etching processes to form inverted mesa portions and chamfers on quartz resonator chips, reducing the thickness ratio and incorporating chamfer structures to minimize crack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the quartz resonator size is reduced to meet lighter and smaller electronic products, then the size of the resonator is reduced, but cracks exceeding 5 μm are easily generated at cutting edges, causing fragmentation and reducing reliability
Solution Approach 1:
The patent applies preliminary action by performing a first etching process on the quartz wafer before singulation to form inverted mesa portions with reduced thickness. This pre-treatment weakens the material structure in advance, making it less prone to crack propagation during subsequent cutting and singulation processes, thereby preventing fragmentation while maintaining miniaturization
Solution Approach 2:
The patent changes physical parameters by creating inverted mesa portions with varying thickness (first thickness greater than second thickness) and forming chamfer structures with specific angles (45-60 degrees). These parameter changes optimize the stress distribution and reduce crack formation at cutting edges, allowing smaller resonator sizes while maintaining reliability
2Ease of manufacture
If conventional single etching process is used, then the manufacturing process is simple, but cracks are generated at cutting edges during singulation
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: first etching process to form inverted mesa portions, singulation to separate resonators, and second etching process to form chamfer structures. This segmentation allows each process to be optimized independently, achieving both manufacturing simplicity and high cutting edge quality through systematic process division
Solution Approach 2:
The first etching process serves as a preliminary action that pre-forms the inverted mesa portions before singulation. This preliminary structuring of the quartz wafer reduces stress concentration at future cut lines, enabling clean separation without crack generation while maintaining overall process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the reliability of quartz resonator chips by minimizing crack occurrence and fragmentation due to external impacts, improving their structural integrity.
Implementation Method 1
A first etching process is performed on the quartz wafer to form multiple inverted mesa portions... A second etching process is performed on the resonator chips to form chamfers at edges of the resonator chips
Implementation Method 2
defining a segmentation lane in the quartz wafer using a laser
Data Source
AI summary
A resonator chip and a manufacturing method thereof are provided. The manufacturing method of the resonator chip includes the following steps. A quartz wafer is provided. The quartz wafer has a first surface and a second surface opposite to the first surface. A first etching process is performed on the quartz wafer to form multiple inverted mesa portions, and the inverted mesa portions has a first thickness. The quartz wafer is singulated to form multiple resonator chips. Each of the resonator chips includes one of the inverted mesa portions. A second etching process is performed on the resonator chips to form chamfers at edges of the resonator chips.