Quartz Crystal Slit Structure for Stress-Resistant Sensor Substrates

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Solution Overview

Problem

Existing structures with slits in quartz crystal substrates face issues with stress concentration at intersection points of different crystal planes, leading to potential breakage during distortion.

Innovation Solution

The structure incorporates a slit design in a quartz crystal substrate where the intersection point of different crystal planes is located inside the substrate, rather than on the inner wall of the slit, preventing stress concentration and breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the slit end portions are formed with end surfaces extending along different crystal planes, then the manufacturing precision is improved, but stress concentration occurs at the intersection point leading to reduced reliability

Engineering Contradiction:
Improveslit end surface precisionVSAvoidstructure reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The harmful intersection point where stress concentrates is extracted from the inner wall surface and relocated to the interior of the substrate. By positioning the intersection point inside the substrate rather than on the inner wall, the design removes the vulnerability point from the stress-bearing surface while maintaining the precision benefits of crystal plane-aligned end surfaces.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The problem is solved by transitioning from a two-dimensional surface arrangement to a three-dimensional spatial configuration. The intersection point is moved from the 2D inner wall surface into the 3D interior space of the substrate, utilizing the depth dimension to eliminate stress concentration while preserving manufacturing precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the intersection point of crystal planes is located on the inner wall of the slit, then the manufacturing process is simplified, but stress concentration leads to breakage during distortion

Engineering Contradiction:
Improveslit formation simplicityVSAvoidresistance to breakage
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The problematic intersection point is extracted from the inner wall location and repositioned within the substrate interior. This maintains the simplicity of forming crystal plane-aligned surfaces while removing the intersection point from positions where it would create stress concentration and potential breakage points.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The design proactively positions the intersection point inside the substrate before any distortion or stress application occurs. This preemptive placement prevents stress concentration from developing at critical surface locations, cushioning against potential breakage before it can occur during subsequent distortion events.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Manufacturing precision

If end surfaces are aligned with crystal planes, then manufacturing precision is improved, but stress concentration at intersection points reduces the structure's resistance to distortion

Engineering Contradiction:
Improvecrystal plane alignmentVSAvoidstress concentration
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The harmful stress concentration effect is extracted from the inner wall surface by relocating the intersection point to the substrate interior. This allows the end surfaces to maintain their precise alignment with crystal planes for manufacturing accuracy while removing the adverse stress concentration from the stress-bearing surface.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Different regions of the structure are given different functional qualities: the end surfaces maintain high precision crystal plane alignment for manufacturing, while the intersection point is positioned in the substrate interior where it does not compromise the local stress distribution and resistance to distortion at the inner wall.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12294352B2Structure, physical quantity sensor, inertial sensor, and method for manufacturing structure
Publication Date: 2025.05.06 SEIKO EPSON CORP
  • US12294352B2 patent drawing
  • US12294352B2 patent drawing
  • US12294352B2 patent drawing

AI summary

A structure is a structure of a quartz crystal substrate having a slit. The structure includes, as an inner wall of the slit, a first side surface, a second side surface, a first end surface, and a second end surface. The first side surface extends along a first direction which is a longitudinal direction of the slit, and the second side surface extends along the first direction. The first end surface is continuous with the first side surface and extends along a first crystal plane of the quartz crystal substrate, and the second end surface is continuous with the second side surface and extends along a second crystal plane of the quartz crystal substrate. In a plan view of the quartz crystal substrate, an intersection point where a first straight line corresponding to the first end surface and a second straight line corresponding to the second end surface intersect each other is located inside the quartz crystal substrate.