Quartz Support Ring With Masked Silicon Coating
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Solution Overview
Problem
Quartz support rings used in thermal processing chambers for substrates, such as semiconducting wafers, develop cracks when repeatedly heated and cooled, leading to frequent replacements and increased costs due to their inability to withstand thermal stresses effectively.
Innovation Solution
A support ring design with a silicon coating of varying thickness, featuring a thicker outer region for radiation blocking and a thinner inner region to reduce stress, is developed to enhance durability and prevent cracking, along with a method for applying the coating using a mask in a deposition chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a uniform thickness silicon coating is applied to the quartz support ring, then radiation blocking performance is improved, but thermal stress resistance deteriorates causing cracks
Solution Approach 1:
The patent applies a non-uniform coating thickness distribution where the coating is thicker at the outer periphery (for radiation blocking) and thinner at the inner region (for stress reduction). This local differentiation resolves the contradiction by optimizing each region for its primary function.
Solution Approach 2:
The coating thickness parameter is varied spatially across the support ring surface. By changing the thickness parameter from uniform to gradient distribution, the patent simultaneously achieves radiation blocking where needed while reducing thermal stress concentration in critical areas.
2Measurement precision
If the support ring is made opaque to lamp radiation, then temperature sensor performance is improved, but manufacturing complexity increases due to coating requirements
Solution Approach 1:
The patent makes only the necessary regions opaque (outer periphery) while leaving inner regions with thinner coating, simplifying the overall structure compared to a fully coated design while still protecting temperature sensors from lamp radiation interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The support ring with a silicon coating of varying thickness significantly reduces cracking under thermal stresses, extending its lifespan and maintaining opacity to radiation, thus improving the cost-effectiveness and reliability of substrate processing.
Implementation Method 1
Because quartz is transparent to light and infrared energy, the upper surface of a quartz support ring is often coated with a material, such as silicon, to render it opaque to the lamp radiation.
Implementation Method 2
forming a coating on the first side, wherein the mask reduces the thickness of the coating on the first side under the mask
Data Source
AI summary
A support ring for semiconductor processing is provided. The support ring includes a ring shaped body defined by an inner edge and an outer edge. The inner edge and outer edge are concentric about a central axis. The ring shaped body further includes a first side, a second side, and a raised annular shoulder extending from the first side of the ring shaped body at the inner edge. The support ring also includes a coating on the first side. The coating has an inner region of reduced thickness region abutting the raised annular shoulder.


